Rediating device
A cooling device and heat sink technology, applied in the direction of cooling/ventilation/heating transformation, instrument cooling, instruments, etc., can solve the problems of cumbersome assembly and achieve the effect of simple and convenient assembly
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[0011] see figure 1 , the heat dissipation device is used for dissipating heat generated by an electronic component (not shown) mounted on a circuit board (not shown). The heat dissipation device includes a heat sink 10 , a fan 30 and a fixing frame 20 for fixing the fan 30 to the heat sink 10 .
[0012] The heat sink 10 is integrally made of metal material, and includes a heat conducting portion and a plurality of cooling fins extending from the heat conducting portion. The heat conduction portion includes a base portion 110, the bottom surface of which is in contact with the electronic components, and the middle part of the top surface of the base portion 110 obliquely extends outwards and upwards to extend two heat conduction wings 130, and the two heat conduction wings 130 form a “V” shape structure. The two wings 130 divide the fin into three regions: two first fin regions located between the base 110 and the wing 130 , and second fin regions located between the two win...
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