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Method for packaging small batch of chips

A small-batch, chip-based technology, which is applied in the manufacture of electrical components, circuits, semiconductors/solid-state devices, etc., can solve the problems of high packaging costs and reduce the cost of small-batch chip packaging, reduce packaging design links, and facilitate popularization and use. The effect of increasing the overall size

Active Publication Date: 2010-02-17
佛山中科芯蔚科技有限公司
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  • Abstract
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Problems solved by technology

[0013] In view of this, the main purpose of the present invention is to provide a method for packaging small-batch chips, that is, a packaging method for small-batch chips, so as to solve the problem that the current small-batch chip packaging cost is too high and reduce the cost of small-batch chips. Package cost

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  • Method for packaging small batch of chips
  • Method for packaging small batch of chips
  • Method for packaging small batch of chips

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Embodiment Construction

[0049] In order to make the objectives, technical solutions and advantages of the present invention clearer, the present invention will be further described in detail below with reference to specific embodiments and accompanying drawings.

[0050] The semiconductor industry has extremely high requirements on the environment and production accuracy. It uses ultra-clean rooms and expensive equipment. Chip foundries (foundry factories) and packaging manufacturers have invested heavily, ranging from tens of millions to billions of dollars. production services. In fact, in addition to commercial high-volume chips, research institutes and many companies need to produce and package small-batch chips for scientific research or new product development needs. These chips are small in quantity (often only tens to hundreds) and have many varieties. They not only require separate tapeouts, but also often use different high-end packaging forms. Chips in this form are harmful to large produ...

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Abstract

The invention relates to the field of encapsulation technology of micro-electronic chips, and discloses a method for encapsulating small amount of chips; the method comprises: a bonding pad layer is determined according to the pin number and the encapsulation size of the chips; the chip which is in accordance with the requirements of the determined chip bonding pad layer is designed and manufactured, and then a flow piece is manufactured; an encapsulation shell which is in accordance with the requirements of the determined chip bonding pad layer is manufactured; the manufactured flow piece andthe encapsulation shell are encapsulated together. By utilizing the invention, the problem that the encapsulation cost of the existing small amount of chips is too high, so that the encapsulation cost of the small amount of chips is reduced.

Description

technical field [0001] The invention relates to the technical field of microelectronic chip packaging, in particular to a method for packaging chips in small batches. Background technique [0002] In today's information age, with the rapid development of the electronic industry, electronic products are required to develop towards multi-function, high performance and miniaturization. With the rapid development of microelectronics technology, the feature size of integrated circuit (IC) chips is getting smaller and smaller and the complexity is increasing, which leads to the pin (Input / output, I / O) of devices and circuits. The number keeps increasing. [0003] Quad Flat Package (Quad Flat Package, QFP) and other packaging technologies with leads on four sides have been widely used in the packaging of semiconductor devices and circuits due to their low cost and high efficiency. However, since the 1990s, the packaging technology with leads on four sides can no longer meet the r...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/50
Inventor 陈岚刘杨叶甜春
Owner 佛山中科芯蔚科技有限公司
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