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Method for reducing viscose bubble for preparatory work of linear cutting

A working method and wire-cutting technology, applied in the direction of working accessories, manufacturing tools, stone processing equipment, etc., can solve the problems of long time required, reduce chip drop rate, and low work efficiency, so as to reduce negative impact and shorten drying time. time and improve work efficiency

Inactive Publication Date: 2010-02-24
JIANGXI SAI WEI LDK SOLAR HI TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] The existing method of reducing air bubbles during the gluing process of objects to be cut, frosted glass, and trays is to rely on manual extrusion or static pressure of heavy objects to drive away the air bubbles caused by uneven gluing. The air bubbles generated in the process are completely discharged, which is very unfavorable for reducing the chip drop rate
Moreover, it takes too long to cure the glue under normal temperature and pressure, and the work efficiency is low.

Method used

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  • Method for reducing viscose bubble for preparatory work of linear cutting

Examples

Experimental program
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Effect test

Embodiment 1

[0035] Embodiment 1, a kind of method for wire cutting preparatory work reduces viscose bubble, wherein: the steps are as follows:

[0036] (1) Place the mounting parts and the object to be cut that are bonded together in a device with a negative pressure function.

[0037] (2) Reduce the air bubbles of the adhesive between the mounting parts and the object to be cut in a negative pressure environment.

Embodiment 2

[0038] Embodiment 2. A method for reducing glue bubbles in preparatory work for wire cutting, wherein: pretreatment is carried out before the installation parts and objects to be cut bonded to each other are installed on the wire cutting equipment, and the steps of pretreatment are as follows :

[0039] (1) Place the mounting parts and the object to be cut that are bonded together in a device with a negative pressure function;

[0040] (2) Adjust the negative pressure technical parameters to vacuumize;

[0041] (3) Reduce the air bubbles of the adhesive between the mounting parts and the object to be cut in a negative pressure environment.

Embodiment 3

[0042] Embodiment 3. A method for reducing glue bubbles in preparatory work for wire cutting, wherein: pre-treatment is performed before the installation parts and objects to be cut bonded to each other are installed on the wire cutting equipment, and the steps of pre-treatment are as follows :

[0043] (1) Brush glue on the contact surface between the object to be cut and the installation part;

[0044] (2) Place the mounting parts and the object to be cut that are bonded together in a device with a negative pressure function;

[0045] (3) Adjust the absolute pressure of the negative pressure technical parameters to be controlled at 0×10 5 Pa, the time control of negative pressure technical parameters is 0.1 minutes.

[0046] (4) Reduce the air bubbles of the adhesive between the mounting parts and the object to be cut in a negative pressure environment.

[0047] The object to be cut is a silicon block used in the fields of polycrystalline silicon, monocrystalline silicon,...

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Abstract

The invention relates to a method for reducing viscose air bubbles of line cutting pre-operation. The method reduces the air bubbles of the adhesive between the installation part and article to be cutunder a negative environment. The method is mainly applied to the preparation stage of the line cutting of article to be cut in the production fields of polycrystalline silicon, monocrystalline silicon and semiconductor. The method reduces the slice dripping rate of the line cutting process, improves the cutting quality of the line cutting, improves the line cutting process, greatly shortens thecuring time of the viscose simultaneously, and reduces the production period of the ling cutting slices.

Description

technical field [0001] The invention relates to a method for reducing glue bubbles in preparatory work for wire cutting, and the method is mainly used in the preparatory stage before wire cutting of objects to be cut. The method is especially applied to the preparatory stage before wire cutting of objects to be cut in the fields of polysilicon, single crystal silicon and semiconductor production. Background technique [0002] Before wire cutting, there is a preparatory work that involves gluing and curing of the object to be cut and the installed part. [0003] The installation part is used to fix the object to be cut glued on it to the hanger of the online cutting equipment, that is to say, after the bonding and curing are completed, the object to be cut is fixed on the hanger of the online cutting equipment through the installation part, and then passed through the wire The cutting device cuts the object to be cut into thin slices. [0004] At present, the commonly used ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B28D7/04
Inventor 中野研吾张存新
Owner JIANGXI SAI WEI LDK SOLAR HI TECH CO LTD
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