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Application method, applicator and processing procedure

A technology of coating and processing liquid, which is applied to the surface coating liquid device, spraying device, coating, etc., and can solve the problem of thinning of the resist coating film

Active Publication Date: 2010-05-19
TOKYO ELECTRON LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Then, when the coating scan starts and the pump as the resist solution supply source starts up, the discharge pressure from the pump drops due to the air mixed into the chamber (air bite occurs), thereby increasing to the set value. The process of constant pressure becomes slow, and as a result, the resist coating film at the beginning of the coating scan becomes thinner

Method used

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  • Application method, applicator and processing procedure
  • Application method, applicator and processing procedure
  • Application method, applicator and processing procedure

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Embodiment Construction

[0120] Preferred embodiments of the present invention will be described below with reference to the drawings.

[0121] figure 1 A coating and development processing system is shown as a configuration example of a coating method, a coating device, and a coating processing program to which the present invention can be applied. The coating and development processing system is installed in a clean room, and takes, for example, an LCD substrate as the substrate to be processed, and performs cleaning, resist coating, pre-baking, developing, and post-baking in the photolithography process in the LCD manufacturing process. Each processing. Exposure processing is performed in an external exposure apparatus (not shown) provided adjacent to this system.

[0122] This coating and development processing system is mainly composed of a cartridge loading and unloading station (C / S) 10 , a processing station (P / S) 12 , and an interface unit (I / F) 14 .

[0123]A cassette loading and unloadin...

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Abstract

In the last stage of the coating scanning procedure, etching resist agent / liquid apophysis RQ, which formerly clings to or follows the lower side face 78b of the etching resist agent nozzle, will be separated form the etching resist agent nozzle 78 by instantly rising scanning speed (rapid acceleration), preferably is left adjacent to guarantee region boundary (LX). Further, as soon as the scanning is finished, the etching resist agent nozzle 78 executes inverse suction on a substrate G so as to eliminate superfluous etching resist agent on coating scanning terminal section, at this time, theinfluence of inverse suction can be counteracted by the left etching resist agent / liquid apophysis RQ so as to prevent the etching resist agent membrane thickness in a guarantee region (ES) decliningunder the predetermine value or allowable range.

Description

technical field [0001] The present invention relates to a coating method, a coating device and a coating treatment program for forming a coating film of a treatment liquid on a substrate to be processed by using a strip-shaped nozzle. Background technique [0002] In the photolithography process in the manufacturing process of flat panel displays (FPD) such as LCDs, the non-spin coating method is often used, that is, the elongated resist nozzle with a slit-shaped discharge port is scanned on the substrate to be processed. (Glass substrate, etc.) [0003] In such a spinless coating method, as disclosed in Japanese Patent Laid-Open No. 10-156255, for example, the substrate is horizontally placed on a mounting table or a workbench, and the substrate on the workbench and the strip-shaped A small gap of several hundred μm or less is set between the outlets of the resist nozzles, and the resist nozzles are moved over the substrate in the scanning direction (generally, the horizon...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B05D1/02B05B13/04B05B13/02B05C11/10G05D3/00
Inventor 藤田直纪绪方庸元若元幸浩
Owner TOKYO ELECTRON LTD
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