Substrate processing apparatus

A substrate processing device and a substrate technology, which are applied in the fields of electrical components, semiconductor/solid-state device manufacturing, circuits, etc., and can solve the problem of reduced operating rate of the substrate processing device 200, increased consumption and discharge of processing liquid, and reduced processing performance of the processing liquid To achieve the effect of improving the operating rate, maintaining the processing performance, and reducing the amount of liquid discharge

Active Publication Date: 2010-04-14
DAINIPPON SCREEN MTG CO LTD
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Problems solved by technology

[0003] However, in the conventional substrate processing apparatus 200, the composition structure of the processing liquid changes with the processing of the substrate W, and the processing performance of the processing liquid may decrease.
For example, when using a treatment solution containing phosphoric acid to etch the surface of the substrate, oxides or nitrides eluted from the surface of the substrate are mixed into the treatment solution as impurities, which will reduce the etching performance of the treatment solution.
Therefore, in the conventional substrate processing apparatus 200, it is necessary to frequently replace the processing liquid with a new liquid, resulting in a reduction in the operating rate of the substrate processing apparatus 200 and an increase in the consumption and discharge of the processing liquid.

Method used

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no. 1 approach

[0060]

[0061] figure 1 It is a figure which shows the structure of the substrate processing apparatus 1 which concerns on one Embodiment of this invention. This substrate processing apparatus 1 is an apparatus for processing a substrate W by immersing a plurality of substrates (hereinafter simply referred to as substrates) W in a processing liquid stored in a processing tank 10 . The substrate processing apparatus 1 mainly includes a processing tank 10 , a piping unit 20 , and a control unit 40 . In this embodiment, for the use of phosphoric acid (H 3 PO 4 ) solution as a treatment solution for etching the surface of the substrate W will be described.

[0062] The processing tank 10 is a container for storing a processing liquid. The processing tank 10 has an inner tank 11 for immersing the substrate W, and an outer tank 12 provided on the outer surface of the inner tank 11 . The treatment liquid supplied to the inner tank 11 is stored inside the inner tank 11 and ov...

no. 2 approach

[0123]

[0124] Figure 6 It is a figure which shows the structure of the substrate processing apparatus 101 which concerns on 2nd Embodiment of this invention. This substrate processing apparatus 101 is an apparatus for processing a substrate W by immersing a plurality of substrates (hereinafter simply referred to as substrates) W in a processing liquid stored in a processing tank 110 . The substrate processing apparatus 101 mainly includes a processing tank 110 , a piping unit 120 , and a control unit 140 . In this embodiment, for the use of phosphoric acid (H 3 PO 4 ) solution is used as the treatment liquid to perform etching treatment on the surface of the substrate W will be described.

[0125] The processing tank 110 is a container for storing a processing liquid. The processing tank 110 has an inner tank 111 for dipping the substrate W, and an outer tank 112 provided at the upper end of the outer surface of the inner tank 111 . The treatment liquid supplied to t...

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Abstract

The invention provides a substrate processing apparatus for processing a substrate via a processing solution capable of decreasing consumption and drainage of the processing solution, while maintaining processing performance of the processing solution and increasing in availability of the substrate processing apparatus. The substrate processing apparatus of the present invention comprises a cooling mechanism for cooling a processing solution and a filter for removing impurities contained in the processing solution, at some midpoint in a circulation path of the processing solution. With this constitution, the substrate processing apparatus can precipitate the impurities dissolved in the processing solution and remove the precipitated impurities. It therefore becomes possible to maintain theperformance of the processing solution and reuse the processing solution. Further, the frequency of changing the processing solution to a new solution decreases, and this causes an increase in availability of the substrate processing apparatus and a decrease in consumption and drainage of the processing solution.

Description

technical field [0001] The present invention relates to a substrate processing apparatus and a substrate processing method for performing predetermined processing such as cleaning and etching on substrates such as semiconductor wafers, glass substrates for liquid crystal display devices, and glass substrates for PDPs. Background technique [0002] Conventionally, in the manufacturing process of a substrate, a substrate processing apparatus is known that processes a substrate with a processing liquid. Figure 11 It is a figure which shows the general structure of the conventional substrate processing apparatus 200. The conventional substrate processing apparatus 200 has a processing tank 210 for storing a processing liquid, and processes the substrate W by immersing the substrate W in the processing liquid stored in the processing tank 210 . Furthermore, the substrate processing apparatus 200 has a circulation unit 220 that circulates the processing liquid by the pressure of ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/00H01L21/306H01L21/67
Inventor 基村雅洋
Owner DAINIPPON SCREEN MTG CO LTD
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