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Dispensing device and mounting system

A dispensing device and dispenser technology, which is applied in the manufacture of electrical components, electrical solid devices, semiconductor/solid devices, etc., and can solve problems such as reduced bond strength and electrode oxidation

Inactive Publication Date: 2007-08-15
TORAY ENG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Since bubbles (gas) remain in the underfill when the underfill is cured due to the use of an underfill containing air bubbles, or evaporation of moisture absorbed by the substrate K, the bonding strength between the substrate K and the chip C will decrease, Or the electrodes for substrate K and chip C will oxidize

Method used

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  • Dispensing device and mounting system
  • Dispensing device and mounting system
  • Dispensing device and mounting system

Examples

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Embodiment Construction

[0044] Fig. 1 shows an installation system with a dispensing device according to an embodiment of the present invention, Fig. 2 shows an enlarged front view of the dispensing device depicted in Fig. 1, and Fig. 3 is a view of the dispensing device depicted in Fig. 2 Partial enlarged front view. In each of the drawings, three axes X, Y and Z in the vertical coordinate system are respectively used, the horizontal direction is called the X-axis direction, the direction perpendicular to the paper is called the Y-axis direction, and the vertical direction is called the Z-axis direction. axis direction, and the direction of rotation around the Z axis is called theta direction.

[0045] As shown in FIG. 1, the mounting system 1 has a structure in which a substrate loader 2, a chip mounting device 3, a distribution device 4, and a substrate unloader 8 are provided in this order. Although not shown, between the substrate loader 2 and the substrate unloader 8, a substrate transport dev...

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PUM

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Abstract

A dispensing device ( 4 ) for charging underfill agent into a gap between a substrate (K) and a chip (C) includes means for storing underfill agent ( 66, 67 ), a chamber ( 52 ) provided for containing substrate (K) to be charged with underfill agent and capable of being opened / closed, a dispenser ( 73 ) provided in the chamber ( 52 ) and discharging underfill agent introduced from the storing means ( 66, 67 ) into the gap between the substrate (K) and the chip (C), and a first pressure reducing means ( 46 ) for reducing the pressure in the chamber ( 52 ) at a predetermined vacuum pressure prior to the discharge of underfill agent by the dispenser ( 73 ). The dispensing device ( 4 ) can supply underfill agent with no bubbles to the substrate (K). A mounting system using this dispensing device ( 4 ) is also provided by the invention.

Description

technical field [0001] The invention relates to a dispensing device and an installation system. More particularly, the present invention relates to a dispensing device that can fill an underfill in a desired form when the underfill is filled into a gap between a substrate and a chip, and a mounting system using the dispensing device. Background technique [0002] FIG. 7 shows a conventional mounting system 9 . This mounting system 9 has a substrate loader 91, a chip mounting device 92, a distribution device 93, and a board unloader 94 (for example, Japanese Patent Application No. 2005-102746). The dispensing device 93 includes a storage device 95 for storing the underfill, a table 96 for placing and holding the substrate K, a dispenser 97 for filling the underfill into the gap between the substrate K and the chip C, and A conduit 98 is connected between the storage device 95 and the dispenser 98 . [0003] In this mounting system 9, the substrate K supplied from the subst...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/56
CPCH01L21/563H01L24/28H01L24/75H01L24/81H01L2224/16H01L2224/73203H01L2224/75H01L2224/81203H01L2224/81801H01L2224/83102H01L2224/92125H01L2924/01005H01L2924/01006H01L2924/01019H01L2924/01033H01L2924/01055H01L2924/01082H01L21/56
Inventor 寺田胜美武井崇
Owner TORAY ENG CO LTD