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Modified microphone packaged structure

A packaging structure and microphone technology, applied in the field of microphones, can solve problems such as short circuit, affecting digital microphones, and difficulty in arrangement, and achieve the effects of overcoming short circuit, easy layout, and simple installation.

Inactive Publication Date: 2011-06-22
SHANDONG GETTOP ACOUSTIC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When making a digital microphone of Φ4mm and below, the digital microphone PCB has 4 electrodes or 5 electrodes, and it is very difficult to arrange 4 or 5 electrodes in this area. It is required that the solder joints of the electrodes in the circle within Φ2.8mm must be smaller than Φ0.6mm, the distance between solder joints is less than 0.2mm, so it is easy for customers to cause a short circuit between electrodes when using it, which affects the use, and the layout of electrodes has also become a technical problem affecting digital microphones

Method used

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  • Modified microphone packaged structure
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  • Modified microphone packaged structure

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Embodiment Construction

[0013] Such as figure 1 , figure 2 , image 3 As shown, the improved microphone packaging structure includes a microphone housing 1, a sound-to-electricity signal converter installed in the microphone housing, and a microphone printed circuit board forming a closed space for installing microphone electronic components with the microphone housing 1 2. The outer surface of the microphone printed circuit board 2 is provided with a conductive electrode 31 for the microphone output signal, and the printed circuit board 2 is provided with a circuit board additional part 21 extending outward along the plane of the printed circuit board 2, The printed circuit board 2 and the circuit board additional part 21 are integrally structured, and the circuit board additional part 21 is provided with a lead-out electrode 32 electrically connected to the conductive electrode 31. The edge sealing device is directly sealed inwardly to the PCB to form an edge sealing 11, and the microphone hous...

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PUM

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Abstract

An improved packaging-structure of microphone is prepared as using microphone shell and microphone printed circuit board to from closed space for erecting electronic elements, arranging conductive electrode for outputting digital signal on surface of said circuit board, arranging additional portion of said circuit board along plane of said circuit board and extending additional portion towards outside, unifying said circuit board and said additional portion to be an integral unit and setting a leading-out electrode connected to said conductive electrode on said additional portion.

Description

technical field [0001] The invention relates to a microphone with a new packaging method. Background technique [0002] Such as Figure 4 , Figure 5 As shown, the printed circuit board (PCB) of the existing microphone is circular or square, and forms a closed space for installing the electronic components of the microphone with the microphone housing 1. Compressed in the shell, the traditional electret microphone has only two electrodes, and it is still feasible to place two electrodes in Φ2.8mm when making Φ4mm. When making a digital microphone of Φ4mm and below, the digital microphone PCB has 4 electrodes or 5 electrodes, and it is very difficult to arrange 4 or 5 electrodes in this area. It is required that the solder joints of the electrodes in the circle within Φ2.8mm must be smaller than Φ0.6mm, the distance between the solder joints is less than 0.2mm, so customers can easily cause a short circuit between electrodes when using it, affecting the use, and the layout ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H04R19/01H04R19/04H04R31/00
Inventor 赵笃仁
Owner SHANDONG GETTOP ACOUSTIC