Packing component for decreasing electromagnetic-wave disturbance

A technology for packaging components and components, which is applied in the field of packaging components to prevent electromagnetic wave interference, and can solve the problems of assembly difficulty and cost increase.

Active Publication Date: 2007-09-05
CYNTEC
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  • Abstract
  • Description
  • Claims
  • Application Information

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However, although this method can achieve a better heat dissipation path, t

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  • Packing component for decreasing electromagnetic-wave disturbance
  • Packing component for decreasing electromagnetic-wave disturbance
  • Packing component for decreasing electromagnetic-wave disturbance

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Embodiment Construction

[0034] Some embodiments of the present invention are described in detail as follows. However, the present invention can be widely implemented in other embodiments other than those described in detail, and the scope of the present invention is not limited, which is subject to the scope of the following patents.

[0035] First, FIG. 3 shows a preferred embodiment disclosed in the present invention, a schematic cross-sectional view of a packaging structure with a shielding structure disclosed in the present invention. The packaging component with a shielding structure includes a substrate 10 without wiring, a shielding structure 12 located on the lower surface of the substrate 10 without wiring, an insulating layer 14 located under the shielding structure 12, and a lead frame 20 with pins 22 located on the bottom surface of the substrate 10 without wiring. On the upper surface of the substrate 10 , the plurality of first components 24 are disposed on the lead frame 20 and the plu...

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Abstract

The invention is concerned with encapsulation component to reduce the disturb of electromagnetic wave, relating to base plant, shadowing structure and insulating-layer under the base plant one by one, and there is crossing-hole filled with conductor to guide the base plant and shadowing structure. Some lead frame with leading foot set on the base plant, and the second base plant is at front of two lead frames. Some the first components set on lead frame, the second component set on front of the second base plant, and the said components connect with each other by lead. The local base plant, the first and the second component and local lead frame are airproofed with molding compound, thus the encapsulation component releases electromagnetic wave/radio frequency to the outside of encapsulation component to reduce interfering to other components in the system, through lead frame, conductor inside of base plant, shadowing structure and grounding end.

Description

technical field [0001] The present invention relates to a packaging component, more particularly to a packaging component that prevents electromagnetic wave interference. Background technique [0002] With the rapid development of electronic technology, electronic devices have been widely used in various fields of human life. With the wide application and development of electronic equipment, a relatively derived issue is the discussion of the electromagnetic interference generated by these electronic equipment and the suppression of interference from non-self-generated interference. Therefore, it is necessary to use electromagnetic compatibility as a problem that needs a lot of discussion at present. . Its purpose is to ensure that the electronic components in the system cannot affect other electronic equipment during operation through the component itself or the system design, resulting in a reduction in work performance or damage to its internal components. [0003] Gene...

Claims

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Application Information

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IPC IPC(8): H01L25/00H01L23/552H01L23/488
CPCH01L2924/19107H01L2224/48247H01L2224/48227H01L2224/48137H01L2924/30107H01L2924/3025H01L2924/181H01L2924/00H01L2924/00012
Inventor 温兆均陈大容林俊良戴志展
Owner CYNTEC
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