Conductive paste and method for manufacturing multilayer printed wiring board using same

一种导电性、导电层的技术，应用在多层印刷布线板的制造领域，能够解决连接可靠性降低、通路孔填充能力差、通路孔残留气泡等问题

Inactive Publication Date: 2007-09-05
SUMITOMO ELECTRIC IND LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, a conductive paste in which a plate-shaped filler is used as conductive particles and kneaded into a low-viscosity resin such as a low-viscosity epoxy resin suffers from the following problems: via-hole filling ability (ability to fill into a via hole) ) poor and residual air bubbles in via holes after filling
Connection reliability decreases when connection resistance changes over time

Method used

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  • Conductive paste and method for manufacturing multilayer printed wiring board using same
  • Conductive paste and method for manufacturing multilayer printed wiring board using same
  • Conductive paste and method for manufacturing multilayer printed wiring board using same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0073] A plate-like Ag filler with an average particle diameter (50%D) of 4 μm was added to 70% by weight of bisphenol A type resin (high molecular weight type with a molecular weight of 55,000) and 30% by weight of rubber (NBR)-modified epoxy In the resin [EPR4030 manufactured by Asahi Denka Kogyo K.K.], the filler was added in such an amount that the proportion in the conductive paste after hardening was 55% by volume, and butyl carbitol acetate was added thereto as a solvent. All the components were mixed in a three-roll mill, and then an imidazole-based latent hardener was added and mixed to manufacture a conductive paste. At this point, pre-mix bisphenol A type resin (high molecular weight type with a molecular weight of 55,000) and butyl carbitol acetate, and then add rubber (NBR) modified epoxy resin [epoxy equivalent: 380g / eq ]Wait.

Embodiment 2

[0075]A conductive paste was prepared in the same manner as in Example 1, except that bisphenol F type epoxy resin [Epicoat 806 manufactured by Japan Epoxy Resin K.K., epoxy equivalent: 160-170 g / eq] was used instead of rubber (NBR) - Modified epoxy resin.

Embodiment 3

[0077] A conductive paste was prepared in the same manner as in Example 1, except that a naphthalene difunctional epoxy resin [HP4032 manufactured by Dainippon Ink and Chemicals, Incorporated, epoxy equivalent: 135˜165 g / eq] was used instead of rubber ( NBR) - modified epoxy resin.

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Abstract

There is provided a conductive paste obtained by kneading conductive particles into an epoxy resin and having good filling ability into a via hole, which can form a connected portion wherein the connection resistance does not change with time even under high temperature and high humidity conditions. Also, there is provided a method for manufacturing a multilayer printed wiring board using the conductive paste. A conductive paste containing conductive particles and a resin mixture wherein the content of the epoxy resin having a molecular weight of 10,000 or more is from 30 to 90% by weight in the total resin component and whose elastic modulus at 85 DEG C after curing is 2 GPa or less, the content of the conductive particle being from 30 to 75% by volume. Furthermore, a method for manufacturing a multilayer printed wiring board using the conductive paste.

Description

technical field [0001] The present invention relates to a conductive paste which is filled into via holes or the like formed during the production of a multilayer printed wiring board to achieve electrical connection between circuits (interlayers). The present invention also relates to a method of manufacturing a multilayer printed wiring board, including the step of filling via holes with the conductive paste. Background technique [0002] A multilayer printed wiring board is known as a technology capable of achieving high-density mounting of components and shortest-distance connection of components. Interstitial via hole (IVH) is a technology applied to the manufacture of multilayer printed wiring boards requiring higher density mounting, characterized in that a hole (via) opened between adjacent layers is filled with a conductive material. holes) to electrically connect the circuits of adjacent layers to each other. According to the IVH, since an interlayer connection c...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01B1/22H05K3/46H01B1/00
CPCH01B1/22H05K1/095H05K2201/0245H05K3/4617H05K2201/0394H05K3/4069
Inventor 冈良雄泷井齐林宪器
Owner SUMITOMO ELECTRIC IND LTD
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