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Polymer blue dye and application of polymer blue dye in acid copper plating process

An acid electroplating, blue dye technology, applied in the direction of organic dyes, etc., to achieve the effect of improving deep plating ability, strong filling and leveling, and shortening electroplating time

Inactive Publication Date: 2009-12-23
SHANGHAI DEJUN SURFACTECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Technical problems to be solved by the present invention The first aspect is to provide a polymeric blue dye as an additive for acidic electroplating copper, so as to solve the problems existing in the existing domestic acidic electroplating copper process

Method used

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  • Polymer blue dye and application of polymer blue dye in acid copper plating process
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  • Polymer blue dye and application of polymer blue dye in acid copper plating process

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Embodiment Construction

[0015] In order to make the technical means and application methods of the present invention easier to understand, the present invention will be further described below in conjunction with specific embodiments.

[0016] Polymeric blue dye is the hydrogen sulfate salt of poly(2-methyl-3-amino-5-phenyi-7-(N, N-diethyiamino)phenazine) of formula (1), wherein n is 10

[0017]

[0018] The preparation method of polymerized blue dye is formed by polymerizing the basic violet 5 dye monomer (Basic Violet5) of formula (2), and the average degree of polymerization is 10

[0019]

[0020] The concentration of the polymerized blue dye in the electroplating solution is between 1.3 mg / L and the temperature is controlled between 10-30°C.

[0021] The polymeric blue dye of this embodiment is used as a leveling agent in the electroplating solution, which can greatly improve the efficiency of the copper electroplating process and shorten the electroplating time, which is 1 / 3-1 / 2 of the tr...

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Abstract

The invention discloses a polymer blue dye, which is hydrosulfate of poly(2-methyl-3-amino-5-phenyi-7-(N,N-diethyiamino)phenazine in a structural formula (1), wherein n is between 8 and 12; the invention also discloses application of the polymer blue dye in an acid copper plating process, greatly improves the efficiency of the copper plating process, and shortens the copper plating time which is 1 / 3 to 1 / 2 of the conventional process time; the filling performance of an acid copper plating layer is extremely strong, so the unfavorable prerequisite condition brought by national plating substrates is avoided; and the appearance of the acid copper plating layer is complete and smooth, and dents of the substrates are effectively filled. The covering power is greatly improved, and the depth requirement beyond the conventional process can be met.

Description

technical field [0001] The invention relates to an acidic electroplating copper additive and its application, in particular to a polymeric blue dye and the application of the polymeric blue dye in an acidic electroplating copper process. Background technique [0002] Generally, an acidic bath for electroplating copper includes (1) a dissolved copper salt such as copper sulfate, (2) an acidic electrolyte such as sulfuric or hydrochloric acid to provide sufficient conductivity for the plating bath, and (3) additives such as surface active Agents, brighteners, leveling agents, inhibitors to improve the quality and efficiency of electroplating, the composition of the electroplating solution can refer to the following US patents: US Patent Nos. 5,174,886; 5,068,013; 5,051,154 and 3,876,513. [0003] At present, the domestic acid electroplating copper process has problems such as insufficient leveling of the electroplating layer, poor depth capability, poor brightness, too long el...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09B69/10C25D3/38
Inventor 唐平
Owner SHANGHAI DEJUN SURFACTECH
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