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Method for the production of magnetron-coated substrates and magnetron sputter source

A magnetron and coating technology, applied in the direction of sputtering coating, coating, discharge tube, etc., can solve the problems of magnetron magnetic field attenuation, large area of ​​smearing target, high eddy current loss, etc.

Active Publication Date: 2010-05-05
OERLIKON ADVANCED TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

In this case, meander-shaped or heart-shaped structures of the magnetic ring pairs are usually used, however, these structures have the disadvantage that they either have multiple inflection points or only insufficiently cover the wide area of ​​the target with respect to large target areas.
Furthermore, especially the narrow radii of the magnetic ring pairs lead to high eddy current losses at increased speeds, for example the rotational speed of the magnet system
These losses are compensated on the one hand by the motor power and on the other hand lead to a decay of the magnetron field
[0013] Static dual-chamber magnetron sources, as described in WO 98 / 03696 or US 5 997 697, have the disadvantage that the static erosion profile is pressed into the sputtering surface

Method used

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  • Method for the production of magnetron-coated substrates and magnetron sputter source
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  • Method for the production of magnetron-coated substrates and magnetron sputter source

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Embodiment Construction

[0046] exist Figure 2a A first embodiment of the method according to the invention or the magnetron source according to the invention is shown in a schematic perspective view, in Figure 2b continues to schematically show the Figure 2a A side view of the device shown in . The target 3 has a sputtering face 3 on the substrate side (the substrate is not shown) S , and away from the substrate has a backside 3 R . on the back 3 R There is a magnet device 5 within the range of the sputtering surface 3 S According to FIG. 2 , at least one self-closing loop generates a tunnel-shaped magnetic field H, wherein the tunnel-shaped magnetic field is a magnetron magnetic field H that is fully familiar to those skilled in the art. In FIG. 2 a single cavity magnetron source is shown. Furthermore, the magnet arrangement 5 has a substantially closed-circling first magnetic ring 7 a and the second magnetic ring 7 inside the first magnetic ring b . The two magnetic rings 7 a 、7 b At...

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Abstract

According to the invention, the sputter rate distribution along the sputter surface (3s) for a magnetron source may be adjusted during the sputter operation, whereby the separation of a piece (7a1, 7b1) of the magnet arrangement (7a, 7b), on the target reverse side (3R) may be correspondingly altered.

Description

technical field [0001] The invention relates to a method for producing a magnetron-coated substrate and a magnetron source. Background technique [0002] definition [0003] exist figure 1 The configuration of the magnetron source is schematically shown in . The magnetron source consists of a sputtering surface 3 S A target 3 , from which the target material is sputtered and deposited reactively or nonreactively on the substrate 4 . on the back of the target 3 R A magnet arrangement 5 is provided. The magnet arrangement has at least one pair of surrounding magnetic rings 7 a and 7 b , these rings face the back of the target 3 R Faces with opposite magnetic polarity. Magnetic ring 7 a or 7 b Each forms a self-closed loop, wherein as long as the sputtering surface 3 of the target 3 is passed through the two magnetic rings S A loop that is itself closed on which the magnetron magnetic field H is generated, "closed" also completely encompasses the magnets spaced apar...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01J37/34C23C14/35
CPCH01J37/3455H01J37/3408H01J37/3429C23C14/35C23C14/54
Inventor J·韦查特
Owner OERLIKON ADVANCED TECH