Method and device for forming external electrodes in electronic chip component

Abstract

A method and device for forming external electrodes on opposing surfaces of an electronic chip. A plurality of chips are arrayed on a plate and held at a first end faces by a silicon rubber provided on the plate. The plate is brought close to a coating bed so that second end faces of the chips are immersed in an electrically conductive paste formed on the coating bed. The second end faces of the chips are coated with the conductive paste which forms first electrodes after drying step. Subsequently, the plate is inverted and brought toward a sheet with a foamable and releasable adhesive layer for allowing the chips to be pressed against the foamable and releasable adhesive and held thereby. The chips are transferred from the plate to the sheet. Next, second electrodes are formed on the first end faces. After the first and second end faces are formed with electrodes, the sheet is heated, causing the foamable and releasable adhesive in the sheet to foam and lose its adhesive strength to remove the components from the sheet by their own weight.

Description

technical field [0001] The invention relates to a method and a device for forming external electrodes in electronic chip components. Background technique [0002] Electronic chip components such as ceramic stack capacitors are well known in the art. One such electronic chip component has a body with two opposite ends. External electrodes are formed on opposite ends of the body. These external electrodes may be formed by applying a conductive paste to the end of the body and then drying the paste. [0003] In a conventional method for forming external electrodes in such an electronic chip component, one end of the electronic component is adhesively held by a first adhesive member in which a through hole is formed, while a first external electrode. Subsequently, the first external electrode side of the electronic component is placed in contact with the second adhesive member in which the through hole is formed. In this state, the pressing member is inserted into the throu...

AI Technical Summary

Problems solved by technology

As a result, a part of the second adhesive member or a part of the electrode fixed to the second adhesive member may break, making the adhesive member unusable or causing damage to the electronic component.

In addition, the cracked residue of the electrode remaining in the second bonded part can reduce the adhesive strength of the bonded part, requiring cleaning or other treatment which can interfere with operation

Images