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Photosensitive composition, pattern forming material, photosensitive laminate, pattern forming apparatus and method of pattern formation

A technology of photosensitive composition and photosensitive layer, which is applied in the field of high-definition wiring patterns and permanent patterns, and can solve the problems of undisclosed, poor spectral sensitivity, and high cost of pattern forming devices

Active Publication Date: 2007-10-10
ASAHI KASEI KK
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] On the other hand, in an exposure apparatus in which a plurality of exposure heads are arranged for exposing a photosensitive material, there is a problem in that when there is a variation in the wavelength of irradiation light caused by a variation in a semiconductor element as an irradiation light source, the The exposed photosensitive material reacts with different sensitivities according to the spectral sensitivity in each region where the exposure wavelength is different, therefore, the uniformity of the formed pattern is damaged
In order to solve this problem, the center wavelength of each of the aforementioned exposure heads is made the same, so there is a problem that the cost of the patterning device is very high
[0005] However, in the above-mentioned proposals, it is not disclosed that the difference in wavelength of the exposure light source is solved by the spectral sensitivity of the photosensitive material without considering the difference in spectral sensitivity with respect to a certain wavelength region centered on the wavelength of the exposure light.
Furthermore, the above-mentioned proposal has a problem in that the sensitivity is insufficient when using a 405 nm solid-state laser that has been in general use in recent years as an exposure light source.

Method used

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  • Photosensitive composition, pattern forming material, photosensitive laminate, pattern forming apparatus and method of pattern formation
  • Photosensitive composition, pattern forming material, photosensitive laminate, pattern forming apparatus and method of pattern formation
  • Photosensitive composition, pattern forming material, photosensitive laminate, pattern forming apparatus and method of pattern formation

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0855] —Production of patterning material for dry film resist —

[0856] On a polyethylene terephthalate film with a thickness of 20 μm as the support, a photosensitive composition solution for a dry film resist composed of the following composition was applied and dried, and then the support was A photosensitive layer with a thickness of 15 μm was formed to form the aforementioned patterning material for dry film resist.

[0857] [Composition of photosensitive composition solution for dry film resist]

[0858] ·Methyl methacrylate / styrene / benzyl methacrylate / methacrylic acid copolymer (copolymer composition (mass ratio): 8 / 30 / 37 / 25, weight average molecular weight: 60,000, acid value 163) 60 mass Share

[0859] · 7.0 parts by mass of polymerizable monomer represented by the following structural formula (75)

[0860] ·Adduct of 1 / 2 mol ratio of hexamethylene diisocyanate and tetraoxirane-methacrylate

[0861] 7.0 parts by mass ...

Embodiment 2

[0889] In Example 1, 10-N-butyl-2-chloroacridone was used instead of N-methylacridone in the photosensitive composition solution for dry film resist. In the same manner as in Example 1, a pattern forming material for dry film resist and a photosensitive laminate for dry film resist were produced. It should be noted that the maximum absorption wavelength of 10-N-butyl-2-chloroacridone as the aforementioned sensitizer is 365 nm.

[0890] In addition, in the same manner as in Example 1, the shortest development time, spectral sensitivity, and minimum exposure that can be patterned were measured. Furthermore, in the same manner as in Example 1, the deviation of the line width was measured. The results are shown in Table 3. It should be noted that the shortest development time is 7 seconds.

Embodiment 3

[0892] In Example 1, 2,2-bis(o-chlorophenyl)-4,4',5,5'-tetraphenylbidiimidazole was set to 0.50 parts by mass. In addition, the same as in Example 1 In the same manner, a pattern forming material for dry film resist and a photosensitive laminate for dry film resist were produced.

[0893] In addition, in the same manner as in Example 1, the shortest development time, spectral sensitivity, and minimum exposure that can be patterned were measured. Furthermore, in the same manner as in Example 1, the deviation of the line width was measured. The results are shown in Table 3. It should be noted that the shortest development time is 7 seconds.

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Abstract

A photosensitive composition that exhibits a substantially constant sensitivity distribution to exposure lights of 400 to 410 nm wavelength, excelling in pattern reproduction, and that exhibits highly inhibited fluctuation with respect to pattern configuration, permitting handling in bright room environment; and including a layer of the photosensitive composition, a pattern forming material and photosensitive laminate; and a pattern forming apparatus and method of pattern formation. There is provided a pattern forming material comprising a support and, superimposed thereon, at least a photosensitive layer of photosensitive composition comprising a binder, a polymerizable compound, a photopolymerization initiator and a sensitizer, the photosensitive layer having a maximum of spectral sensitivity in a 380 to 420 nm wavelength region, wherein the minimum exposure intensity capable of pattern formation at 400 nm, S<sub.

Description

Technical field [0001] The present invention relates to a photosensitive composition suitable for dry film resist (DFR), solder resist, liquid solder resist, etc. that can form images by UV exposure. In particular, it relates to a pattern forming material and a photosensitive laminate using the photosensitive composition, a pattern forming apparatus equipped with the pattern forming material and the photosensitive laminate, a pattern forming method, and a high-definition wiring pattern, permanent Pattern (protective film, interlayer insulating film, solder resist pattern, etc.). Background technique [0002] In the field of printed wiring boards, it is common to first form a copper wiring pattern with a copper-plated film laminate using DFR. Furthermore, soldering is performed on the wiring pattern on which components such as semiconductors, capacitors, and resistors are formed. At this time, for example, in the IR reflow soldering process, in order to prevent the solder from adh...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/028G03F7/004G03F7/027G03F7/029G03F7/031H01L21/027
CPCG03F7/031G03F7/0045G03F7/0295G03F7/028G03F7/029G03F7/004G03F7/0047G03F7/20G03F7/202G03F7/027
Inventor 田代朋子佐藤守正佐佐木义晴若田裕一高柳丘
Owner ASAHI KASEI KK
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