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Imaging-free optical element contact image sensing device

An image sensing and imaging optics technology, applied in the directions of image communication, electrical components, etc., can solve the problems of increased manufacturing cost, assembly tolerance, and bulky volume of the known contact image sensing device.

Inactive Publication Date: 2007-11-14
LITE ON SEMICON
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, as can be seen from FIG. 1 and FIG. 2, the GRIN imaging optical element 50a is a necessary element of the known contact image sensing device, but because of the use of the GRIN imaging optical element 50a, not only the known contact image sensing device The volume is too large, and the assembly tolerance of the known contact image sensing device is generated
In addition, since the GRIN imaging optical element 50a is very expensive, the production cost of the conventional contact image sensing device increases.

Method used

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  • Imaging-free optical element contact image sensing device
  • Imaging-free optical element contact image sensing device
  • Imaging-free optical element contact image sensing device

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Embodiment Construction

[0042] Please refer to FIG. 3 and FIG. 4 , which are respectively a perspective view and a side view of the first embodiment of the imaging optical element-free contact image sensing device of the present invention. It can be seen from the figure that the present invention provides a contact image sensing device without imaging optical elements, which includes: a circuit board 2 , a light emitting module 3 and an image sensing module 4 .

[0043] The light emitting module 3 is electrically connected to the circuit board 2 . Wherein, the light-emitting module 3 can be composed of one light-emitting element or a plurality of light-emitting elements arranged in a line, and the light-emitting module 3 can be selected from fluorescent lamp (Fluorescent Lamp), electroluminescence ( Electro luminescence, EL), light emitting diode (LED) or any light emitting device to use. However, the above-mentioned arrangement of the light emitting modules 3 is not intended to limit the present in...

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Abstract

The image-sensing device includes circuit board, luminescence module, and image-sensing module. The luminescence module is connected to the circuit board electrically; the image-sensing module is connected to the circuit board electrically; and the image-sensing module is exposed. Using the luminescence module emits a beam of light to a manuscript; being near to the manuscript, the image-sensing module receives reflected light from the manuscript directly. The invention omits use of well known imaging optical elements so as to reduce production cost and volume, as well as solve issue of assembling tolerance.

Description

technical field [0001] The present invention relates to a contact image sensing device free of imaging optical elements, in particular to a contact image sensing device by omitting the use of GRIN (Gradient Reflective Index) imaging optical elements. Background technique [0002] Please refer to FIG. 1 and FIG. 2 , which are respectively an exploded perspective view and a side sectional view of a conventional contact image sensing device. As can be seen from the figure, the known contact image sensing device includes: a package housing 10a, a circuit board 20a, a cover glass 30a, an image sensing element 40a, a GRIN imaging optical element (Gradient Reflective Index) 50a and A light emitting element 60a. [0003] Wherein, the upper cover glass 30a and the circuit board 20a are respectively disposed on the upper and lower ends of the packaging case 10a, thereby creating upper and lower spaces 100a, 200a, and the image sensing element 40a is disposed on the circuit board 20a ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04N1/04
Inventor 郑家驹吴诗斌吕育维许敦程
Owner LITE ON SEMICON