Film forming device, film forming method, and method of producing organic el element

A film-forming device and film-forming method technology, applied in the direction of electrical components, electroluminescent light sources, semiconductor/solid-state device manufacturing, etc., can solve the problems of not being able to obtain film-forming patterns, spend manufacturing time, and waste time, and achieve shortened production Interval time, shortened manufacturing time, effect of shortened manufacturing time
CN101090995AInactive Publication Date: 2007-12-19MITSUI ENG & SHIPBUILD CO LTD +1
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
MITSUI ENG & SHIPBUILD CO LTD
Publication Date
2007-12-19
Estimated Expiration
Not applicable · inactive patent

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Abstract

A film forming device has a source for feeding a film forming material and a substrate on which a film of the film forming material is formed. The film forming device is constructed from a mask (36) provided on the front side of the substrate so as to be movable in a direction approaching and leaving the front surface of the substrate; a magnet (22) provided on the rear side of the substrate so as to be movable in a direction approaching and leaving the rear side of the substrate; and a movement limitation means (24) for limiting the movement of the magnet (22) within a predetermined range.
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Description

technical field

[0001] The invention relates to a film forming device, a film forming method and a manufacturing method of an organic electroluminescent (EL) element. Background technique

[0002] A film forming apparatus for forming a predetermined pattern on a substrate includes: a chuck for holding the substrate in a planar shape, a mask formed of a magnetic material forming a predetermined opening pattern, and a device for fixing the mask on the substrate. magnet. Furthermore, at the time of film formation, the substrate is mounted and held on the surface of the chuck, and the mask is covered on the substrate. The mask is held on the substrate by the magnetic force of a magnet placed on the back of the chuck.

[0003] Next, in Patent Document 1 disclosed regarding a thin film forming apparatus, it is described that by keeping the permanent magnet away from the substrate when the mask is fixed on the substrate, and bringing the permanent magnet close to the substrate af...

Claims

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