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Radiation fin for counterflow type heat exchanger and method of manufacturing heat exhanger

A technology of heat exchanger and manufacturing method, which is applied in the direction of heat exchange equipment, lighting and heating equipment, cooling/ventilation/heating transformation, etc., and can solve the problems of mutual contact, affecting heat dissipation effect, and the heat sink structure can not be too compact, etc. , to achieve the effect of improving heat dissipation performance and compact structure

Inactive Publication Date: 2008-02-06
锐德科无线通信技术(上海)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Existing counter-flow heat exchangers generally use "ji"-shaped cooling fins, as shown in Figure 1. Although this structure can speed up the heat loss to a certain extent, it cannot be installed when installed. Too compact, that is to say, there needs to be enough distance between adjacent heat sinks, otherwise adjacent heat sinks may touch each other, which will directly affect the heat dissipation effect
In order to solve the problem of mutual contact between adjacent heat sinks, some radiators set up protrusions 2 between adjacent heat sinks 1, as shown in Figure 2 and Figure 3, but this will make the structure of the heat exchanger too complicated, Installation is troublesome

Method used

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  • Radiation fin for counterflow type heat exchanger and method of manufacturing heat exhanger
  • Radiation fin for counterflow type heat exchanger and method of manufacturing heat exhanger
  • Radiation fin for counterflow type heat exchanger and method of manufacturing heat exhanger

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Embodiment Construction

[0020] The structure of the cooling fins of the counterflow heat exchanger of the present invention is shown in Figure 4 and Figure 5. The body 1 of the cooling fins is a sheet-like structure, and a plurality of regularly arranged mushroom-shaped structures are arranged on the cooling fin body. Protrusion 3. The protruding directions of any two adjacent protrusions are opposite, respectively protruding toward two sides of the heat sink. Corrugations 4 are arranged on the heat sink body. The heat sink is made of aluminum foil.

[0021] The present invention also provides a method for manufacturing a heat exchanger composed of cooling fins of the above-mentioned counterflow heat exchanger, comprising the following steps:

[0022] (1) To inspect the aluminum foil sheet, the surface of the aluminum foil sheet should have no serious scratches, scratches, or cracks, and there should be no looseness, cracks, or inclusions when observed under a low-power metallographic microscope, s...

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Abstract

The present invention discloses a heat radiating flange of a counter flow type heat exchanger; the body of the heat radiating flange is a sheet structure and is provided with a plurality of regularly distributed mushroom-shaped bosses. The present invention still discloses the producing method of a heat exchanger formed by the heat radiating flanges of the counter flow type heat exchanger; in the producing process, a plurality of heat radiating flanges are laminated to form a heat radiating flange group; two adjacent heat radiating flanges extrude and contact with each other so as to make the heat radiating flange bodies keep a certain distance. As the sheet heat radiating flanges are provided with regularly distributed bosses, when producing the heat exchanger, the adjacent heat radiating flanges are provided with a certain distance because of the mutual contact of the bosses so as to make the structure of the heat radiating flanges in the heat exchanger more compact, and to effectively prevent the adjacent heat radiating flanges from jointing together, improving the heat radiating capability of the heat exchanger.

Description

technical field [0001] The invention relates to a cooling fin of a heat exchanger, in particular to a cooling fin of a counterflow heat exchanger. The invention also relates to a manufacturing method of the counterflow heat exchanger. Background technique [0002] Now, with the development of technology, more and more electrical and electronic devices have entered people's lives, and their types and functions are becoming more and more abundant. Some devices emit a lot of heat when they are working due to their high power consumption. Most electronic components are very sensitive to temperature changes. If the heat is not transferred out in time, it will directly affect the normal operation of the equipment, and even burn the equipment and cause a fire in severe cases. Therefore, for such high-power and high-calorie equipment, a heat dissipation device is generally specially provided to enable it to work normally and safely. [0003] In the existing heat dissipation devic...

Claims

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Application Information

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IPC IPC(8): H05K7/20F28F3/02
Inventor 陈云
Owner 锐德科无线通信技术(上海)有限公司