Exposure device
An exposure device and a technology to be exposed are applied in photolithography exposure devices, microlithography exposure equipment, optics, etc., which can solve problems such as large-scale devices, ineffective dust removal, and difficulty in dust removal, so as to achieve effective dust removal and high yield Effect
Inactive Publication Date: 2008-02-13
ADTEC ENG
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Problems solved by technology
[0007] However, the current situation is that the above-mentioned conventional technologies all use a cleaning roller structure, which has little effect on adhesive dust such as resists.
In addition, in the exposure device, since there are vacuum bonding and exposure processes, the resist adheres firmly to the mask and the platen, making it more difficult to remove dust. There are limitations
[0008] In addition, since an adhesion roller mechanism is required to remove dust adhering to the cleaning roller, there is a problem of increasing the size of the device and increasing the cost.
Method used
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Embodiment Construction
[0023] Embodiments of the present invention will be described below with reference to the drawings.
[0024] 1 is an exposure apparatus for manufacturing a printed wiring board. A printed wiring board B to which a photoresist has been applied is placed on a platen 5 and moved in XYZ and θ directions by an exposure table 7 . In the exposure part 20, the photomask M attached to the mask holder 6 (mask holder) is arrange|positioned above the board|substrate B, and the light source 9 is also provided on it. The exposure beam from the light source 9 will expose the pattern drawn on the photomask M on the substrate B.
[0025] An input unit 30 is provided on one side of the exposure unit 20, and the substrate B is input here from the previous process. An input hand 3 is provided on the input unit 30 , and the input hand 3 absorbs and fixes the substrate B and transports the substrate B onto the platen 5 .
[0026] The output part 40 is provided on the other side of the exposure pa...
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The invention provides an exposure device which provides an exposure with a high yield by effectively removing the attached dust on a photomask and a platen. A first cleaning head is installed at the exposure portion side of the input hand. A scraper extends out and contacts the upper surface of the platen at the predetermined position when the input hand inputs, and removes the dust when moving on the platen followed by the movement of the input hand. A second cleaning head is installed at the exposure portion side of the output hand and removes the dust of the photomask when the output hand moves to the exposure portion and / or outputs.
Description
technical field [0001] The present invention relates to exposing devices. technical background [0002] Photoetching method (photolithographic method) on the surface of the substrate coated with photoresist and other photosensitive materials, the predetermined pattern is photosensitive burned by the exposure device, and then the pattern is formed on the substrate through the etching process. This photoetching method is widely used in various fields. It is widely used, and in recent years, printed wiring boards and the like are also manufactured using exposure equipment. [0003] In an exposure apparatus for a printed circuit board (print circuit board), if dust exists between a photomask (photo mask) and a substrate, there is a problem that the part is not exposed and becomes a defective product. [0004] In this dust, there are, for example, dust that is not self-adhesive such as copper foil, and dust that is self-adhesive such as dry film photoresist (dry film photo resis...
Claims
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Patent Timeline
Login to View More IPC IPC(8): G03F7/20H05K3/06
CPCG03F7/2014G03F7/70308G03F7/7035G03F7/70691G03F7/70733G03F7/7075
Inventor 渡辺义光
Owner ADTEC ENG