Nano thin film with separation and protection function and manufacturing method thereof

A nano-film, protective function technology, applied in the field of protective film and its manufacturing, can solve the problems of low speed, uneven thickness of the barrier layer, large porosity, etc.

Inactive Publication Date: 2008-02-20
BEIJING BEIYIN EAST ORIENT NEW MATERIALS TECH
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Problems solved by technology

[0002] In the prior art, there are many types of protective films in terms of manufacturing methods and varieties and structural forms. For protective films that can block gas molecules and have protective functions, one is to combine the barrier layer with the adhesive through the chemical coating method. The substrates are bonded to each other. One is to deposit the barrier layer on the substrate by using the existing plasma chemical vapor deposition (PECVD) method; the common disadvantages are that the density is not high and the porosity is large. Therefore, t...

Method used

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  • Nano thin film with separation and protection function and manufacturing method thereof
  • Nano thin film with separation and protection function and manufacturing method thereof

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Embodiment Construction

[0020] Further auspicious explanation in conjunction with accompanying drawing;

[0021] Described nano film is attached on the base material, and base material is flexible base material, is generally organic film, as polyethylene film (PE), polypropylene film (PP), oriented polypropylene film (OPP) and polyethylene terephthalic acid Ethylene glycol ester film, etc.; or the base material is regular or irregular ornaments, protective articles, cultural relics and functional devices, etc.

[0022] The organosilicon chemical monomer:

[0023] Hexamethyldisiloxane (C 6 h 18 OSi 2 ), octamethyltetrasiloxane (C 8 h 24 o 4 Si 4 ) or tetramethyldisiloxane (C 4 h 14 OSi 2 ); are all liquids, which are used as working gases after gasification.

[0024] The thickness of the nano-film is 1-1000nm, generally controlled at 50-200nm; the permeability to oxygen is less than 50ml / cm 2 / 24h, generally 15~25ml / cm 2 / 24h; the permeability to water vapor is less than 10g / m ...

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Abstract

The invention relates to a nano film with the function of obstructing and protection and the manufacturing method belonging to the technical field of protective film and manufacturing method, aiming at improving the performance of protective film; with the plasma device which is provided with a magnetic field strengthening device, the plasma chemical vapor deposition and the gas of organic silicone chemistry as the working gas, the nano film is manufactured on the parent metal surface by depositing and converging with a thickness of 1 to 1000nm, a transmission rate of oxygen less than 50ml/cm2/24h and a transmission rate of water vapor less than 10g/m2/24h. The magnetic field strengthening device is magnet assembly(12) made of permanent magnets, consisting of an outside and inside magnet assembly(13),(14) which are respectively corresponding to a left and a right roll electrode(2),(3), and the magnetic field strengthening device can increase the density of the plasma in the plasma area; the nano film has high density, great obstructing performance, uneasy breaking-off and corrosion resistance, being widely applicable as the protective layer for food, drug package and functional apparatus; the manufacturing method is suitable for the production line of continuous coiling based on the parent metal.

Description

technical field [0001] The invention belongs to the technical field of protective film and its production, and relates to a nano film with barrier and protective functions and its production method. Background technique [0002] In the prior art, there are many types of protective films in terms of manufacturing methods and varieties and structural forms. For protective films that can block gas molecules and have protective functions, one is to combine the barrier layer with the adhesive through the chemical coating method. The substrates are bonded to each other. One is to deposit the barrier layer on the substrate by using the existing plasma chemical vapor deposition (PECVD) method; the common disadvantages are that the density is not high and the porosity is large. Therefore, the performance of barrier gas molecules is low, the bonding strength with the substrate is low, and it is easy to fall off; in addition, the adhesive used in the former has chemical pollution, and ...

Claims

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Application Information

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IPC IPC(8): C23C14/12C23C16/50C23C16/52
Inventor 陈强张跃飞付亚波杨丽珍孙运金
Owner BEIJING BEIYIN EAST ORIENT NEW MATERIALS TECH
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