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LED illuminating module heat dissipation and abating protection device

A technology for LED lighting and failure protection, which is applied to lighting devices, lighting device parts, lighting device safety devices, etc.

Inactive Publication Date: 2008-03-19
SUZHOU FORCECON ELECTRIC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] The invention provides a heat dissipation failure protection device for an LED lighting module, the purpose of which is to solve the problem that the LED lamp group is easily overheated and damaged, or even exploded when the heat dissipation fan is abnormal and the heat dissipation effect is lost

Method used

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  • LED illuminating module heat dissipation and abating protection device
  • LED illuminating module heat dissipation and abating protection device
  • LED illuminating module heat dissipation and abating protection device

Examples

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Embodiment

[0035] Please refer to Figures 1 to 12, which are preferred embodiments of the present invention, these embodiments are for illustration only, and are not limited by this structure in patent applications; the LED lighting module includes LED lamp groups 10 , power supply unit 11, cooling fan 12; and the LED lamp group 10 and the power supply unit 11 are connected by a main power supply circuit 20, and the cooling fan 12 and the main power supply circuit 20 are connected by a series circuit or a parallel circuit ;

[0036] Wherein, a control circuit 30 is added between the main power supply circuit 20 and the cooling fan 12, and a current control member is arranged between the first end 31 of the control circuit 30 and the main power supply circuit 20, so that the power supply of the main power supply circuit 20 The flow is weakened or interrupted, and the second end 32 of the control circuit 30 is connected to a detection module 50. The detection module 50 can make the aforeme...

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PUM

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Abstract

The invention provides a heat radiation failure protection device of an LED illumination module. The device mainly comprises an LED lamp cluster, a power supply unit and a heat radiation fan; the heat radiation fan is connected on the main power supply circuit in series or in parallel, a controlling circuit is additionally arranged between the main power supply circuit and the heat radiation fan, and a current controlling component (like a field effect transistor, a three electrode tube, a relay, or a thyristor, etc.) is arranged between the controlling circuit and the main power supply circuit; when the heat radiation fan of the LED illumination module runs abnormally, the power supply current flow quantity of the main power supply circuit can be weakened or in an interruption state through the controlling circuit and the reaction action of the current controlling component, to lead the LED lamp cluster to be transformed and in faint light or power off state, and thereby achieving the protection effect of effectively preventing the over heated damage and the explosion of the LED lamp cluster, in order to further improve the operational safety and the quality of the LED illumination module, and to lead the LED illumination module to have the practical progression.

Description

technical field [0001] The invention relates to an LED lighting module, in particular to an innovative design capable of synchronously shutting down the LED or presenting a weak current state to produce protection when the cooling fan fails. Background technique [0002] LED lighting modules are currently widely used in various lighting and light-emitting display product structures due to their advantages of lower power consumption, longer service life and high illuminance compared to traditional light bulb structures. [0003] The LED lighting module, its LED light-emitting elements will generate a certain degree of heat when it is lit, the more the number of LED light-emitting elements configured in the module, the higher the total heat generated, and because the overall LED light-emitting The components are all assembled on the same substrate structure, so the heat cannot be completely dissipated through the air naturally, but is conducted to the substrate structure to co...

Claims

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Application Information

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IPC IPC(8): F21V29/02F21V23/00F21V25/04H05B37/03F21Y101/02F21V29/67F21Y115/10
Inventor 饶振奇周德樟
Owner SUZHOU FORCECON ELECTRIC
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