Ball replanting technology for global array encapsulation chip

An array packaging and chip technology, applied in the direction of electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve problems such as unsatisfactory solder joint strength, inappropriate amount of solder paste, and increased costs, so as to improve the repair success rate and Restorative quality, low-cost results

Inactive Publication Date: 2008-03-26
伟创力电子科技(上海)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] 1. The amount of solder paste is not appropriate, resulting in irregular ball shape of the ball array package chip;
[0004] 2. The height of the solder ball is inconsistent;
[0005] 3. The streng...

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0016] The present invention will be further described below in conjunction with specific embodiments.

[0017] In this embodiment, the steps of reballing the ball array packaged chip are as follows:

[0018] a. According to the size of the pads and solder balls of the ball array packaged chips, design and purchase two stencils, A and B, respectively. The thickness of steel mesh A is 0.13mm, and the opening is the diameter of the pads of the ball array packaged chips minus 0.1-0.15 mm, the thickness of the steel mesh B is 0.25 mm, and the opening is the diameter of the solder ball of the ball array package chip plus 0.1-0.15 mm.

[0019] b. Bake the components and clean the pads.

[0020] c. The fixed element is on a special fixed base, making it immovable in the horizontal and vertical downward directions.

[0021] d. Align the stencil A and stencil B with the spherical array packaged chip on the special fixed base, so that all the openings on the stencil correspond to the ...

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PUM

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Abstract

This invention discloses a technology of re-implanting balls for spherical array package chips characteriaing that said technology takes a spherical array package chip as a PCB for assembling and applies a surface sticking technology to process it, which increases success rate and quality of modification of ball-iimplantation effectively.

Description

technical field [0001] The invention relates to a component reshaping and repairing method in the electronic manufacturing industry, in particular to a ball replanting process for ball array packaging chips in the electronic manufacturing industry. Background technique [0002] A Ball Array Chip is an integrated circuit, an electronic component used in printed circuit board assembly. After the ball array package chip is removed from the printed circuit board, it must be re-balled before it can be reused. The previous process used stencils to print solder paste and fill them with solder balls to repair the ball array packaged chips. The stencil opened holes according to the size and arrangement of the ball array packaged chip solder balls; due to the thickness of the stencil, The location and opening design are relatively simple, so there are the following defects: [0003] 1. The amount of solder paste is not appropriate, resulting in irregular ball shape of the ball array...

Claims

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Application Information

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IPC IPC(8): H01L21/60H01L21/28
Inventor 李仕荣李青松
Owner 伟创力电子科技(上海)有限公司
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