Ball replanting technology for global array encapsulation chip

Abstract

This invention discloses a technology of re-implanting balls for spherical array package chips characteriaing that said technology takes a spherical array package chip as a PCB for assembling and applies a surface sticking technology to process it, which increases success rate and quality of modification of ball-iimplantation effectively.

Description

technical field [0001] The invention relates to a component reshaping and repairing method in the electronic manufacturing industry, in particular to a ball replanting process for ball array packaging chips in the electronic manufacturing industry. Background technique [0002] A Ball Array Chip is an integrated circuit, an electronic component used in printed circuit board assembly. After the ball array package chip is removed from the printed circuit board, it must be re-balled before it can be reused. The previous process used stencils to print solder paste and fill them with solder balls to repair the ball array packaged chips. The stencil opened holes according to the size and arrangement of the ball array packaged chip solder balls; due to the thickness of the stencil, The location and opening design are relatively simple, so there are the following defects: [0003] 1. The amount of solder paste is not appropriate, resulting in irregular ball shape of the ball array...

AI Technical Summary

Problems solved by technology

[0003] 1. The amount of solder paste is not appropriate, resulting in irregular ball shape of the ball array package chip;

[0004] 2. The height of the solder ball is inconsistent;

[0005] 3. The strength of solder joints does not meet the requirements

[0006] The above reasons lead to a low success rate of ball placement, and it is easy to cause damage to the ball array package chip and increase the cost