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A tin overflow concave external open kettle mouth

A pot mouth and concave technology, which is applied in the field of tin furnace parts, can solve the problems that it is not suitable for large-scale batch processing, low work efficiency, and easy to form joints.

Inactive Publication Date: 2008-03-26
SUZHOU MINGFU AUTOMATIC SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] In order to overcome the shortcomings of the above-mentioned various solders, especially when automatic selective point-to-point wave soldering is used to weld PCBA boards with dense solder joints, the work efficiency is low, it is not suitable for large-scale batch processing, and the joints are easy to form virtual soldering. The invention provides a tin furnace spout with simple structure, which can effectively improve welding efficiency and ensure the quality of welding joints

Method used

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  • A tin overflow concave external open kettle mouth

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Embodiment Construction

[0015] As shown in Figure 1, a tin-spill concave-shaped outwardly opening spout, the spout is composed of a long and narrow rectangular main spout 1 and at least two branch spouts 2 fixedly arranged on the side of the main spout 1, End spouts 3 are arranged at both ends of the main spout 1 . There is an overflow tin mouth 4 on the concave periphery formed by the branch spout 2 and the main spout 1 on both sides, and the end spout connected to the main spout 1 at the junction of the main spout 1 and the branch spout 2 3 A tin overflow port 4 is provided on the connection surface. The tin overflow hole 4 is a rectangular gap, and the depth of the tin overflow hole 1 is 2-8mm.

[0016] As shown in Figure 2, the spout of the present invention is mainly applied to the electronic components 6 to be welded on the PCBA board 5, which are mainly distributed in the main spout 1 area, and other electronic components that need to be welded are scattered outside it. Components 6, in this...

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Abstract

The invention relates to a tin furnace component used to PCBA board soldering tin, in particular to a tin furnace kettle orifice. The kettle orifice consists of a long and narrow rectangular main kettle orifice and at least two branch kettle orifices which are arranged fixedly on sides of the main kettle orifice, end kettle orifices are arranged at both ends of the main kettle orifice, a tin overflow outlet is arranged at the concave circumference which consists of two adjacent branch kettle orifices and the main kettle orifice, and a tin overflow is arranged at the joint of the main and branch kettle orifices, and at the connected surface of the end kettle orifices and the main kettle orifice respectively, the overflow orifice is a rectangular opening, the deepness is 2-8mm. The invention has a simple structure, can improve the soldering efficiency, is suitable for mass automatic production, in addition, effectively prevents an oxide layer of the tin liquid surface from remaining on the PCBA board, assures the welding joint quality.

Description

technical field [0001] The invention relates to a tin furnace component used for PCBA board soldering, in particular to a tin furnace spout. Background technique [0002] The usual wave soldering is usually manually operated, and the production efficiency is relatively low. For PCBA boards that require dense soldering points, this soldering method is even more insufficient. In addition, because the tin outlet is too small (generally 2 mm long), it will bring Tin slag blocks the mouth of the pot, which leads to a large area of ​​false soldering; for PCBA boards with denser solder joints, there are also pot mouth structures, but the usual tin furnace pot mouth is designed as a flat mouth, in order to realize PCBA board Soldering operation generally needs to keep a distance between the PCBA board and the spout. On the one hand, it is ensured that the tin liquid sprayed from the spout can solder the electrical components on the PCBA board above, and at the same time, it is guara...

Claims

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Application Information

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IPC IPC(8): H05K3/34
Inventor 庄春明
Owner SUZHOU MINGFU AUTOMATIC SCI & TECH
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