Wafer inspecting equipment

Abstract

The present invention relates to a checking device of the wafer, which can simultaneously do the testing to the thinner adhesion of the wafer and the thickness measuring to the photoresistor on the surface of the wafer and including the side surface checking to the wafer with exposure edge. The inner side of the device body (1) which is provided with a top surface, a lower surface and a side surface comprises the following components: a sucking disc (2) which fixes and rotates the wafer; a first device (3) which is arranged at the top side of the sucking disc (2) and detects the thinner adhesion on the surface of the wafer arranged on the sucking disc (2); a second device which simultaneously checks the top side surface and the lower side surface of the wafer and does side surface checking to the wafer with combining these checking; and a third device which does measuring to the thickness of the photoresistor of the wafer arranged on the sucking disc (2). Thereby the rapidness and easiness of the wafer checking can be ensured and meanwhile the checking including the side surface checking to the edge exposure which can not be checked in the existing technique can be executed, so the invention has the effect of realizing the correctness and rapidness of the wafer checking.

Description

technical field [0001] The present invention relates to a wafer inspection device (Wafer inspecting equipment), especially the diluent attachment inspection of a wafer, the thickness measurement of a photoresistor coated on the wafer surface, and the inspection of a wafer including edge exposure can be performed simultaneously with one device. Inspection device for side inspection of wafers. Background technique [0002] Usually, the coating method of the photoresistor is: after the wafer is fixed and installed on the workbench, as shown in Figure 1, the photoresistor PR is sprayed to the center of the upper surface of the wafer W, and the wafer W is rotated at a predetermined speed. , so that the photoresistor PR concentrated in the center is coated on the entire surface of the wafer, this is because: by uniformly coating the photoresistor on the entire area of ​​the wafer, during exposure, even in the center and peripheral parts of the wafer Using the same exposure energy...

AI Technical Summary

Problems solved by technology

[0010] On the other hand, the above-mentioned series of inspections, that is, the inspection of the stain of the wafer due to the adhesion of the diluent and the inspection of the thickness of the photoresistor coated on the surface of the wafer cannot be carried out simultaneously, and it is necessary to use different inspection devices for inspection and inspection. Confirming the above-mentioned defects, not to mention the cumbersome and inconvenient inspection work, there is also a problem that the work speed and efficiency are reduced

[0011] In addition, the stain inspection of the wafer caused by the above-mentioned diluent deposits is only performed on those that can be confirmed with the naked eye, and the inspection of the diluent deposits that cannot be confirmed by the naked eye is not performed. Cameras are installed on the upper and lower parts of the wafer to inspect the particles on the upper and lower sides of the wafer. In essence, it is impossible to perform debris inspection on the edge of the wafer, that is, side inspection.

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