A laminated multi-layer flexible printed circuit board and its making method

Abstract

The printed circuit board includes following composing portions: single sided boards in outmost two layers; cover membranes on the single sided boards; double sided boards with circuit being etched on in middle layers and pressed together through half solidifying glue; and cover membranes in inner layers for double sided boards. The invention also discloses method of making: combined hot pressing the single sided boards in outmost layers, the half solidifying glue, and the double sided boards with circuit being etched on directly. The invention can leave out some steps for hot pressing total single sided boards layer by layer so as to shorten manufacturing cycle, and raise production efficiency. The invention also reduces use of cover membranes in inner layers and half solidifying glue so as to reduce total side thickness of product, material cost, and enhance wrapping and folding performance of circuit board.

Description

technical field [0001] The invention relates to the manufacture of printed circuit boards, in particular to a laminated multilayer flexible printed circuit board and its manufacturing method. Background technique [0002] A multilayer flexible printed circuit board (Flexible Printed Circuit board, referred to as FPC) has a multilayer routing function and can adapt to complex electrical performance requirements, so it is widely used. The existing laminated multilayer FPC is generally made of conductive layers and insulating layers alternately on the inner layer of the completed multilayer board in a laminated manner, consisting of several layers of single panels and prepreg insulating sheets arranged between them. Combined, its production method includes two parts. One part is the production of the inner layer circuit, which has the following steps in sequence: single-sided material cutting → pasting photosensitive film → exposure and development → etching circuit → removing...

AI Technical Summary

Problems solved by technology

[0003] A technical problem to be solved by the present invention is to overcome the defects of the existing multilayer boards, such as the total side thickness, high material cost, and poor folding performance, and propose a laminated multilayer flexible printed circuit board

[0004] Another technical problem to be solved by the present invention is to overcome the shortcomings of the existing multi-layer board production process, such as long process flow, thick product side, high material cost, and poor folding performance, and propose a laminated multi-layer flexible printed circuit Manufacturing method of the board

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