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Ultrasound transducer assembly having improved thermal management

A transducer and ultrasonic technology, applied in ultrasonic/sonic/infrasonic diagnosis, sounding equipment, sonic diagnosis, etc., can solve the problem of expensive active cooling device

Inactive Publication Date: 2008-04-23
KONINKLIJKE PHILIPS ELECTRONICS NV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Active cooling is expensive and includes delicate cooling

Method used

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  • Ultrasound transducer assembly having improved thermal management
  • Ultrasound transducer assembly having improved thermal management

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Embodiment Construction

[0017] The medical ultrasound imaging system of the present invention provides an ultrasound transducer assembly with improved thermal management. Such an ultrasonic transducer assembly includes an array of ultrasonic transducers and corresponding circuitry and is adapted to transmit ultrasonic energy along a propagation path. Furthermore, the ultrasonic transducer assembly of the present invention is capable of conducting heat to at least one heat sink from all heat sources in the assembly, namely the ultrasonic transducer array and corresponding circuitry.

[0018] Referring now in detail to the drawings, in which like reference numerals indicate similar or identical elements, there is shown a medical ultrasound imaging system according to the present invention, which is generally referred to as ultrasound imaging System 200. In the following description, conventionally the term "proximal" refers to the part of the appliance closest to the operator and the term "distal" ref...

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Abstract

An improved thermal management of an ultrasound transducer assembly is provided. The ultrasound transducer assembly includes an ultrasound transducer operable to transmit ultrasound energy along a propagation path; and a self-contained cooling system thermally coupling the ultrasound transducer to at least one heat sink. The self- contained cooling system includes at least one heat transfer member. The self-contained cooling system defines a heat flow from the ultrasound transducer assembly to the heat sink via the at least one heat transfer member. The propagation path of the ultrasound energy is opposite in direction to the heat flow path. The heat transfer process is augmented by the addition of a thermoelectric cooler positioned in thermal communication with the ultrasound transducer assembly. The self-contained cooling system provides for minimum thermal resistance, while the thermoelectric cooler maintains the heat flow in a positive direction and maintains positive thermal gradients thus enhancing the heat flow to the heat sink.

Description

technical field [0001] The present invention generally relates to medical ultrasound imaging systems for visualizing soft tissue organs in internal regions of the body. More particularly, the present invention relates to an ultrasonic transducer assembly with improved thermal management. Background technique [0002] Ultrasound imaging is medical diagnostic imaging that allows the visualization of soft tissue organs in internal regions of the body. Ultrasound imaging procedures typically involve placing an ultrasound transducer assembly or transducer probe on the patient's skin near the area involved, such as on the back, to form an image of the kidney. [0003] An ultrasonic transducer is operable to transmit ultrasonic energy along a propagation path and includes a transducer array and corresponding circuitry in operative communication with the ultrasonic array. While the design of an ultrasound transducer assembly has been successful and widely accepted as the preferred...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): A61B8/00
CPCA61B8/00G10K11/004A61B8/4472A61B8/546
Inventor J·哈特
Owner KONINKLIJKE PHILIPS ELECTRONICS NV
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