Fast criterion for through hole ability of black hole agent used for flexible printed circuit board
A technology of flexible printing and black hole agent, which is used in the formation of electrical connection of printing components, instruments, measuring devices, etc., can solve the problems affecting the quality and reliability of FPC products, reduce the defect rate of hole copper, and improve the quality and reliability. Effect
Inactive Publication Date: 2012-03-28
江苏美梵生物科技有限公司
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Problems solved by technology
However, it is difficult to detect the change of the black hole through-hole ability in time by using the above-mentioned test piece, resulting in many defective products without copper in the holes in the subsequent through-hole plating, which seriously affects the quality and reliability of FPC products
Method used
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[0019] Such as figure 1 , 2 The rapid determination method of the through-hole capacity of the black hole agent for FPC shown is a method of qualitative filter paper filtration, which has the following steps in turn:
[0020] (1) First wet the medium-speed qualitative filter paper 3 and stick it in the funnel;
[0021] (2) the medium speed qualitative filter paper 3 is placed on the Erlenmeyer flask 4 of 250ml that the volume that the inner wall is moistened together with the funnel 2;
[0022] (3) filter the 20ml black hole agent 5 sampled from the black hole of the FPC through the medium-speed qualitative filter paper 3 along the glass straight rod 1, and collect in the Erlenmeyer flask 4;
[0023] (4) Record the filtration time with a timer. The black hole agent 5 with normal through-hole ability has a filter time within 28 minutes, and observe the time when the filtrate diffuses up to the neck of the conical flask with a capacity of 250 ml on the 4 wall, and the black ho...
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The invention discloses a quick judging method for the perforating ability of black hole agent used for flexible printed circuit board (PCB), which is characterized in comprising the following steps: (1) wetting a sheet of qualitative filter paper and adhering the paper in a hopper, (2) placing the qualitative filter paper along with the hopper on an Erlenmeyer flask with wet internal wall, (3) filtering the black hole agent through the qualitative filter paper along a straight rod with smooth surface and collecting the black hole agent in the Erlenmeyer flask, (4) recording the filter time by use of a chronograph, and observing the speed at which the black hole agent is dispersed upwards on the wall of the Erlenmeyer flask, and (5) dipping and dripping the black hole agent on the qualitative filter paper, and observing the situations in which the black hole agent is dispersed around on the qualitative filter paper after setting time. By recording the full filter time of the black hole agent, the speed at which the filtrate is diffused upwards on the wall of the Erlenmeyer flask, as well as whether separate water spots appear, the invention has the advantages of detecting whether precipitation of the black hole agent appears in time, accurately determining whether the perforating ability is normal, remarkably reducing the open-cell copper defect rate in the subsequent perforating electroplating step, and markedly enhancing the quality and reliability of FPC products.
Description
technical field [0001] The invention relates to the manufacture of printed circuit boards, in particular to a method for quickly judging the through-hole capability of a black hole agent for flexible printed circuit boards. Background technique [0002] In the manufacturing process of Flexible Printed Circuit board (FPC for short), there is a drilling blackening treatment (Black Hole) step: including the hole drilled on the FPC to make the hole wall with a hole-preparing agent. After the positive charge, the carbon powder with negatively charged particles is attached to the inner wall of the hole through the black hole agent, and then the carbon powder on the copper surface is peeled off by micro-etching, and only a layer of carbon powder is left on the insulating position of the inner wall of the hole for copper plating. Afterwards, a via hole is formed to connect the wires of different layers connected to the via hole. The method for judging the through-hole capability of...
Claims
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IPC IPC(8): G01N33/00H05K3/40
Inventor 刘登志
Owner 江苏美梵生物科技有限公司