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Contact apparatus for minimizing the load of mechanically loaded SMT soldered joints

A technology of contact device and plug-in device, which is applied in the direction of preventing contact with live contacts, components of connection devices, contact parts, etc., which can solve the problem of unable to absorb mechanical load force flow dispersion, SMT plug-in connection does not include stability And other issues

Active Publication Date: 2008-05-07
SIEMENS AG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

If such auxiliary structures do not exist, SMT plug-in connections generally do not include sufficient stability to absorb mechanical loads or distribute force flows to stable components

Method used

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  • Contact apparatus for minimizing the load of mechanically loaded SMT soldered joints
  • Contact apparatus for minimizing the load of mechanically loaded SMT soldered joints
  • Contact apparatus for minimizing the load of mechanically loaded SMT soldered joints

Examples

Experimental program
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Embodiment Construction

[0036]FIG. 1 shows a perspective view of a contact carrier 7 of a contact device 3 with a plurality of contacts 5 . In the exemplary embodiment, the contact carrier 7 comprises six contacts 5 , of which only a partial assembly of the contacts 5 , ie a contact foot 25 and a contact body 26 , can be seen from FIG. 1 . The contacts 5 are fixed by clamping them in the clamping means 14 of the contact carrier 7 . Six recesses 30 for contact pins 25 are provided on the elongated front side of the contact carrier 7 along the rows of contacts 5 . By means of these recesses 30 it is possible to mount the contact device 3 flush on the printed circuit board 4 even with the contacts 5 clamped in the clamping device. Furthermore, the contact carrier 7 of the contact device 3 also includes a guide strip 17 on its two shorter sides. The guide strip 17 ensures correct insertion of the contact carrier into a first housing part 8 . The insertion is performed in three steps (see Figures 4, 5 ...

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Abstract

Contacting mechanism for SMT component mounting on circuit board connects its contacts to conductive tracks of circuit board via solder points and has contact holder (7) while contacts are arranged to coact with countercontacts.Contact mechanism contains first housing part with one or more recesses for contact holder and STP(s) for contact, catching up impact forces during impacting of contacts with respective countercontacts. Independent claims are included for SMT plug connector. -

Description

technical field [0001] The invention relates to a contact device for SMT mounting on a printed circuit board, wherein the contact device is used to connect at least one contact of the contact device with at least one contact of the printed circuit board through at least one solder joint. An electrically conductive connection is established between a printed conductor, the contact device includes a contact holder for accommodating the contact, and the contact of the contact device is used for connecting at least one mating electrical contact. [0002] The invention also relates to an SMT plug-in connection comprising at least one contact arrangement of the type described above. Background technique [0003] This contact device for SMT (Surface Mount Technology) solder joints is used in the manufacturing process of printed circuit boards. SMT modules (also known as "printed circuit boards") are highly standardized and require the use of high-quality manufacturing and mounting...

Claims

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Application Information

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IPC IPC(8): H01R13/516H01R9/05H01R12/04H01R13/04H01R13/44
CPCH01R13/44H01R13/04H01R12/515H01R9/0503H01R12/716H01R13/516H01R9/093
Inventor 克里斯琴·威德曼迈克尔·弗赖穆特西格弗里德·诺伊曼
Owner SIEMENS AG
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