Temperature control method and apparatus for high-power LED

A temperature control method and a technology of a temperature control device, which are applied in lighting devices, energy-saving control technology, cooling/heating devices of lighting devices, etc., can solve the problems of limited heat dissipation effect, large radiator resources, and failure to achieve heat dissipation effect, etc., to achieve The effect of reducing consumption, saving resources and prolonging service life

Inactive Publication Date: 2008-05-14
鸿宝科技股份有限公司
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Problems solved by technology

[0005] To sum up, in the process of realizing the present invention, the inventor found that there are at least the following problems in the prior art: in the existing technical solutions for dissipating heat from high-power LEDs, many factors need to be considered in the selection of radiators. The heat dissipation technology of high-power LED needs to consume more heat sink resources, and the heat dissipation effect is also limited by the selected heat sink, which cannot achieve the expected heat dissipation effect

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  • Temperature control method and apparatus for high-power LED

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Embodiment Construction

[0033] The embodiment of the present invention provides a temperature control method and device for a high-power LED, which combines a high-power LED, a suitable heat sink, and a driving power supply for a high-power LED with constant current and voltage, so that the high-power LED and the heat generated by the driving power supply can be gathered together, and then the temperature signal of the radiator is obtained, and the temperature signal is transmitted to the driving power supply; the driving power supply is controlled by the driving power supply according to the temperature signal working status. In this way, the working state of the high-power LED can be controlled, thereby realizing the control of the working temperature of the high-power LED, prolonging the service life of the high-power LED and the driving power supply, and effectively reducing the amount of the radiator and saving resources.

[0034] In order to better describe the embodiment of the present inventi...

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Abstract

The embodiment of the invention provides a method and a device for temperature control of a large-power LED. The invention comprises the following steps: the large-power LED is connected with a radiator and the radiator is connected with a driving power supply of the large-power LED; a temperature signal of the radiator is obtained and is transmitted to the driving power supply; then the driving power supply controls the working status of the driving power supply according to the received temperature signal. Therefore, the work status of the large-power LED is controlled, thereby realizing the control over the work temperature of the large-power LED, prolonging the service life of the large-power LED and the driving power supply, effectively reducing the consumption of the radiator and saving resource.

Description

technical field [0001] The invention relates to the field of light-emitting diodes, in particular to a temperature control method and device for high-power LEDs. Background technique [0002] At present, high-power LED (Light Emitting Diode, light-emitting diode) lighting is an energy-saving, high-efficiency and environment-friendly product that is widely concerned in the world. Due to the above-mentioned advantages of high-power LEDs, people have paid more and more attention to them, and they are widely used in various fields. [0003] However, the service life of current high-power LEDs is mainly affected by temperature, which involves the heat dissipation of high-power LEDs. The more commonly used heat dissipation method is to use a radiator to dissipate heat to ensure the service life of high-power LEDs; or to control the operating current of high-power LEDs through a constant current power supply to limit the normal use temperature of high-power LEDs. Guarantee the se...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05B37/02F21V29/00H01L23/34F21Y101/02F21Y115/10
CPCY02B20/42Y02B20/40
Inventor 郭晓锋杜瑞庆杜姬芳
Owner 鸿宝科技股份有限公司
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