Substrate processing apparatus

A substrate processing device and substrate technology, which are applied to devices, optics, instruments, etc. for coating liquid on the surface, to achieve the effect of suppressing the amount of calculation processing and improving the accuracy

Active Publication Date: 2008-05-21
DAINIPPON SCREEN MTG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, there is a problem that the pressure measured by such a pressure sensor is a value affected by a primary delay, and when used for actual control, it is necessary to perform calculations taking this delay into consideration.

Method used

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no. 1 approach

[0032] 1 is a perspective view schematically showing a substrate processing apparatus 1 of the present invention, and FIG. 2 is a side cross-sectional view showing a main body 2 of the substrate processing apparatus 1 and showing main components related to a resist liquid coating operation.

[0033] In FIG. 1 , for ease of illustration and description, it is defined that the Z-axis direction represents the vertical direction, and the XY plane represents the horizontal plane. However, these are defined for the convenience of grasping the positional relationship, and are not limited to the directions described below. The same applies to the following drawings.

[0034] The substrate processing apparatus 1 is roughly divided into a main body 2 and a control section 8, and a square glass substrate used for manufacturing a screen panel of a liquid crystal display device is used as a substrate to be processed (hereinafter simply referred to as "substrate") 90, which is formed on the ...

no. 2 approach

[0120] In the first embodiment, in the control value acquisition step (step S11 ), not only the control value of the pump 61 but also the control value of the traveling mechanism 5 is set. That is, the control value of the traveling mechanism 5 is also preset before the coating process.

[0121] However, in the coating process (step S13 ), the pressure sensor 413 may always measure and control the traveling mechanism 5 so as to follow the measured value when coating starts. That is, the traveling mechanism 5 may be controlled based on the measurement result of the pressure sensor 413 every time the coating process is performed.

[0122] Even with such a configuration, the same effect as that of the first embodiment can be obtained.

[0123]

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PUM

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Abstract

The invention relates to a substrate processing device which can measure the state of the processing liquid sprayed from a slit nozzle accurately. The invention is provided with a pipe (42) for extracting air at the secondary side of the slit nozzle (41). The pipe (42) is independent instead of directly communicating with the pipe (63) positioned at the first side of the slit nozzle (41). Besides, the pipe (42) is directly communicated with a stream (410) inside the slit nozzle (41). The pipe (42) is provided with a pressure sensor (413) so as to transfer the measure value to a control part (8). The corrosion resistance liquid is supplied to the slit nozzle (41) through a pump (61) and the pressure inside the pipe (42) at this time is measured through the pressure sensor (413).

Description

technical field [0001] The present invention relates to a technique for controlling the discharge of a treatment liquid in a slit coater, and more specifically, relates to a measurement technique for accurate control. Background technique [0002] It is known to apply a treatment liquid such as a photoresist to the surface of a glass square substrate for liquid crystal, a semiconductor wafer, a flexible substrate for thin-film liquid crystal, a substrate for a photomask, a substrate for a color filter, etc. (hereinafter simply referred to as "substrate"). Coating device. As a coating device, there is, for example, a slit coater that performs slit coating using a slit nozzle having a slit-shaped discharge portion. In the slit coater, the control (uniformity) of the coating film thickness is a particularly important element because variation in the coating film thickness (coating unevenness) causes variation in the wiring width. [0003] The slit coater sprays the resist fro...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B05C11/02B05C11/10
CPCB05C5/0258G02F1/1303H01L21/6715H01L21/67253
Inventor 高木善则冈田广司
Owner DAINIPPON SCREEN MTG CO LTD
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