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Smart card preparing technique

A preparation process and technology for smart cards, which are applied to record carriers, instruments, computer parts, etc. used in machines, can solve the problems of lowering the yield of smart cards and increasing production costs, and achieve easy quality control, lower production costs, and higher production efficiency. Effect

Inactive Publication Date: 2011-08-10
中电智能卡有限责任公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

It not only reduces the yield rate of the entire smart card production, but also relatively increases the production cost a lot

Method used

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Examples

Experimental program
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Embodiment Construction

[0026] like figure 2 As shown, the present invention specifically includes:

[0027] Step 1: Firstly, print patterns on the upper surface of the upper substrate and the lower surface of the lower substrate, which is the same as the conventional process;

[0028] Step 2: As image 3 As shown, the upper base material 1 is punched out with an outer hole 4 corresponding to the size of the outer tank, and the middle base material 2 is punched out with an inner hole 5 corresponding to the size of the inner tank. The position of the outer hole 4 is the same as that of the inner hole 5. Adaptation, the purpose is to ensure that the center of the outer hole coincides with the center of the inner hole in the subsequent lamination process;

[0029] Step 3: If Figure 4 , 5 The stamped upper and middle base materials 1, 2 and the lower base material 4 are stacked and laminated to form a large card base 6;

[0030] Step 4: If Image 6 As shown, the laminated large card base 6 is pun...

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Abstract

The invention discloses a smart card preparation process, comprising the following procedures: (1) the top base materials is punched into external holes with the same size of external slots, the middle base materials is punched into internal holes with the same size of the internal slot, the position of the external holes is corresponding to that the internal holes; (2) the top, the middle and the bottom base materials are superposed and laminated into card matrix of large width; (3) the laminated card matrix of large width is punched into card matrix of small width, and an integrated circuitmodular is to be implanted into every hole of the punched card matrix of small width. The invention has the advantages that operability is enhanced compared with the slot milling process due to the elimination of the slot milling process procedure, productivity and product quality is greatly improved, and the production cost is reduced.

Description

technical field [0001] The invention relates to a production process of a smart card. Background technique [0002] At present, the application of smart cards is becoming more and more common, not only in communication and transportation, but also in enterprises, banks, schools, taxation, public security, medical care, catering, hotels and entertainment, scientific research, books, museums, tourism, customs, etc. aspect. Therefore, the demand for smart cards is also increasing year by year. At present, there is an annual demand of nearly 2 billion smart cards in China alone. [0003] The existing smart card production process is mainly to make a small smart card by performing a series of treatments on several layers of card bases. Specific process steps such as figure 1 Shown: First, the upper surface of the upper substrate and the lower surface of the lower substrate are printed on the surface; then they are stacked with the substrate of the middle layer for "lamination...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G06K19/077
Inventor 胡建溦李磊
Owner 中电智能卡有限责任公司
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