The invention belongs to the field of double-interface cards, and particularly relates to a double-interface card production process. The process comprises the following steps: a), winding a coil on a coiling layer, folding, laminating and punching the coiling layer and polyvinyl chloride (PVC) sheets to form a card, wherein the coil is needed by a double-interface card; b), milling a groove on the punched card obtained by the step a) at two ends of the coil, adjusting the depth of the milling groove step by step until a paint layer of a copper wire of the coil is milled and copper is exposed; c), soldering, milling, gluing and punching on a module to obtain a small module; and d), dotting solder paste on the surface of the copper wire of the coil in a frame of the milling groove of the card, fixing the small module obtained by the step c) in the frame of the milling groove, and forming in a thermo-compression mode. Compared with an existing production process, the double-interface card production process is simple, groove milling is only needed once, through the solder paste, the module is enabled to be directly connected with the copper wire of the coil of which the paint layer is milled, package is finished through the thermo-compression, and production efficiency and quality are improved greatly.