Soldering stove with stannum-spilled port single welding type kettle port

A soldering furnace and tin overflow technology, which is applied in the direction of assembling printed circuits with electrical components, can solve the problems of high equipment requirements, pressure fluctuations affecting welding area and welding quality, and affecting welding quality, etc., to achieve strong adaptability and stable tin pressure. , the effect of simple structure

Inactive Publication Date: 2008-05-21
苏州明杰自动化科技有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This kind of structure requires that the PCB board and the spout maintain a relatively constant distance during the soldering process of the solder furnace. A slight change in the distance will directly affect the welding quality and have high requirements for the equipment. In addition, the spout The pressure fluctuation of the tin liquid will also affect the welding area and welding quality

Method used

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  • Soldering stove with stannum-spilled port single welding type kettle port

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Embodiment Construction

[0012] As shown in Figure 1, the single-point welding spout of the soldering furnace with overflow tin hole is composed of a shrinking tin-spraying tube 1 and a lower bottom plate 2. The tin-spraying tube 1 is fixed on the lower bottom plate 2, and the tin-spraying tube 1 A tin overflow hole 6 is arranged on the top, and the bottom bottom plate 2 is installed on the tin furnace panel 3, and the two can be fixedly connected together by welding. On the lower bottom plate 2 and the tin stove panel 3, there is a through tin inlet hole 4, and a hollow nut 5 is screwed in the tin inlet hole 4 to fix the lower bottom plate 2 and the tin stove panel 3 together. The tin-spraying tube 1 is composed of a tapered tube body 1-1 and a cylindrical tin-spraying port 1-2, wherein the inner diameter of the tin-spraying port 1-2 is D=2-10mm, and the wall thickness S=0.5-3mm.

[0013] When in use, molten tin enters from the tin furnace through the hollow nut 5 into the spout formed by the tin-spr...

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Abstract

The invention relates to a tinning furnace component for the soldering tin of PCB board, in particular to a spout of soldering tin furnace. The invention is composed of a taper tin spray pipe and a lower shoe; a tin overflow hole is arranged at the tin spray pipe; the tin spray pipe is fixedly positioned at the lower shoe; the lower shoe is arranged on a tinning furnace panel; a run-through tin inlet is arranged at the lower shoe and the tinning furnace panel respectively; a hollow nut is screwed in the tin inlet so as to make the lower shoe be fixed together with the tinning panel; the tin spray pipe is composed of a taper pipe body and a cylindrical tin spray nozzle, wherein the inner diameter D of the tin spray nozzle is 2 to 10mm, and the wall thickness S is 0.5 to 3mm. The single spot welding kettle spout with tin overflow hole of the invention has the advantage of simple structure; and the invention can realize the welding for single electronic components on the PCB board conveniently and rapidly without manual operation; thereby the work efficiency is improved and the tin pressure of the spout is stable; the position of the spout can be adjusted according to the welding position of the PCB board, and the adaptability is strong.

Description

technical field [0001] The invention relates to a tin furnace component used for PCB board soldering, in particular to a tin furnace spout. Background technique [0002] The usual single-point welding of PCB boards is performed manually, which has low work efficiency and high work intensity, and the welding quality is difficult to control, so it is impossible to implement mass production of PCB boards in batches. In addition, when wave soldering adopts the spout structure to weld the PCB board above the spout, the spout of the tin furnace is designed as a flat mouth. Keep a certain distance between them, on the one hand to ensure that the tin liquid sprayed from the spout can weld the electrical components on the upper PCB board, and at the same time ensure that the tin liquid sprayed from the spout can be discharged from the spout in time to prevent the pot from Excessive mouth pressure will affect the welding quality. This kind of structure requires that the PCB board an...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/34
Inventor 严仕兴
Owner 苏州明杰自动化科技有限公司
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