A single-point soldering pot mouth with overflow tin hole

Abstract

The invention relates to a tin stove part for PCB plate soldering tin, in particular to a tin stove kettle mouth which is formed by a necking-shaped tin spraying tube and a lower bottom plate. A tin overflow hole is arranged on the tin spraying tube which is fixed on the lower bottom plate, the lower bottom plate is installed on the panel of a tin stove, tin feeding holes which are communicated are arranged on the lower bottom plate and the tin stove panel, the tin feeding holes are internally screwed with hollow nuts to fix the lower bottom plate together with the tin stove panel, the tin spraying tube is composed of a taper-shaped tube body and a cylinder-shaped tin spraying hole, wherein, the inner diameter D of the tin spraying hole is equal to 2-10 mm, and the wall thickness S is equal to 0.5-3 mm. The invention provides the single spot welding kettle mouth with the tin overflow hole, and the kettle mouth has the advantages that the structure is simple, the welding to each electronic element of the PCB plate can be conveniently and fast realized, the manual operation can be discarded, the working efficiency can be improved, the tin pressure at the kettle mouth is stable, the position of the kettle mouth can be adjusted according to the welding position on the PCB plate, and the applicability is strong.

Description

technical field [0001] The invention relates to a tin furnace component used for PCB board soldering, in particular to a tin furnace spout. Background technique [0002] The usual single-point welding of PCB boards is performed manually, which has low work efficiency and high work intensity, and the welding quality is difficult to control, so it is impossible to implement mass production of PCB boards in batches. In addition, when wave soldering adopts the spout structure to weld the PCB board above the spout, the spout of the tin furnace is designed as a flat mouth. Keep a certain distance between them, on the one hand to ensure that the tin liquid sprayed from the spout can weld the electrical components on the upper PCB board, and at the same time ensure that the tin liquid sprayed from the spout can be discharged from the spout in time to prevent the pot from Excessive mouth pressure will affect the welding quality. This kind of structure requires that the PCB board an...

AI Technical Summary

Problems solved by technology

This kind of structure requires that the PCB board and the spout maintain a relatively constant distance during the soldering process of the solder furnace. A slight change in the distance will directly affect the welding quality and have high requirements for the equipment. In addition, the spout The pressure fluctuation of the tin liquid will also affect the welding area and welding quality

Images