Method for measurement of straightness of metallic fine wire and measuring equipment of same

Abstract

Provides a simple and accurate measurement method for evaluating the straightness of a thin metal wire that causes meandering of soldered (crimped) wires. After hanging down the thin metal wire and photographing the thin metal wire from the vertical direction, distinguish the most intervals of 2 to 25 times the length of the arc-shaped connecting line and evaluate the meandering degree of the curve obtained from the photographed image. The meandering of the welding (pressing) wiring that affects the leveling is controlled by the interval of the parallel lines holding the curve into a meandering width, but the long-period meandering will not affect the leveling even if the meandering width is large, and will affect the leveling The serpentine with a smaller radius of curvature is related to the length of the arc-shaped connecting line and grasps the width of the serpentine in the above-mentioned interval. The photographic section of the welded (pressed) wiring is matched with the accuracy of the machine to divide the tested welded (pressed) wiring section into the length direction, and the enlarged image in the width direction is processed into binary data, which is evaluated as a continuous curve.

Description

technical field [0001] The present invention relates to a measuring method and a measuring device for the straightness of a wire-drawn metal thin wire used for crimping a lead wire, etc. Refers to the measurement method and measurement device for the straightness of metal thin wires in the range of 0.015 to 0.025 mm. Background technique [0002] For a long time, the thin metal wire processed by pre-drawing is pre-wound on a reel and pre-stretched, and is cut into a fixed length and used during use. Metal thin wires processed in this form include lead wires of electrical components, lead wires of detectors, bead wires of automobile tires, and welding (pressing) wires for semiconductor devices, such as for connecting electronic circuit components or circuits. Bump wires or soldered (pressed) wires for substrates are very common forms. Such thin metal wires are used depending on the application, such as metals such as Au, Ag, Pd, Pt, Al, Cu, Fe, Ni, Pb, Sn, W, or alloys main...

AI Technical Summary

Problems solved by technology

[0019] The purpose of the present invention is to measure the meandering degree showing three-dimensional deformation with good precision in a two-dimensional manner, and to solve the problem that the absolute value of the diameter and meandering width of the thin metal wire is extremely small and cannot fully correspond to the photography used for image reading. The precision of the optical machine used

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