Method for measurement of straightness of metallic fine wire and measuring equipment of same

Abstract

The invention provides a method for simply and accurately estimating the truth and straight character of a sinuous fine metal thread as the one reason for measuring the welding (pressing) line. The fine metal thread is put vertically and is imaged from the vertical direction. A plurality of sections which are 2 to 25 times of the length of the arc connecting wire is distinguished and the sinuous degree of the curve which is obtained from the image is estimated. The sinuous property influencing the measurement of the welding (pressing) line is designed to a sinuous width through the space of aparallel line clamping the curve, while the long-term sinuous property not influences the measurement even the sinuous width is relatively large. The sinuous property influencing the measurement so that the curvature radius is relatively small is related to the length of the arc connecting line and is designed into a sinuous width of the section. The image of the welding (pressing) line distinguishes the pre-welding (pressing) line into the length direction relative to the precision of the machine and processes the amplified image on the width direction into a data of 2 as a continuous curve for estimation.

Description

Technical field [0001] The present invention relates to a method and a measuring device for measuring the straightness of a thin metal wire that has been cut to a fixed length for joining the ends of a thin wire that has been cut to a fixed length. The wire diameter is in the range of 0.007 to 0.1 mm. It refers to the measuring method and measuring device for the straightness of thin metal wires in the range of 0.015 to 0.025mm. Background technique [0002] The thin metal wire that has been pre-stretched for a long time is pre-wound on a reel and pre-stretched, and cut into a fixed length before use. The thin metal wires processed in this form include the leads of electrical components into the leads of the detector, the lip line of automobile tires, and the welding (crimping) wiring for semiconductor devices, such as for connecting electronic circuit components or circuits The bump bonding wire or soldering (crimping) wiring used for the substrate is an extremely common form. ...

AI Technical Summary

Problems solved by technology

[0019] The purpose of the present invention is to measure the meandering degree showing three-dimensional deformation with good precision in a two-dimensional manner, and to solve the problem that the absolute value of the diameter and meandering width of the thin metal wire is extremely small and cannot fully correspond to the photography used to read the image. The precision of the optical machine used

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