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Device and method for processing dielectric materials

A technology of dielectric materials and devices, used in circuits, electrical components, semiconductor/solid-state device manufacturing, etc.

Inactive Publication Date: 2010-10-27
AXCELIS TECHNOLOGIES
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] Ultraviolet radiation devices currently do not exist that address the specific problems and concerns associated with curing and / or removing porogens from various dielectric materials

Method used

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  • Device and method for processing dielectric materials
  • Device and method for processing dielectric materials
  • Device and method for processing dielectric materials

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0064] In this embodiment, multiple substrates comprising the same dielectric material are processed in an apparatus as described above. Figure 12 The efficiency of the periodic cleaning-in-place function is shown in a graph. The clean-in-place process includes flowing an oxidizing fluid into the process chamber and exposing the oxidizing fluid to ultraviolet broadband radiation. The irradiance detector measures the intensity of the ultraviolet broadband radiation entering the processing chamber. During the processing of multiple substrates containing dielectric materials, the transmittance of ultraviolet broadband radiation decreases as a function of the substrate being processed due to outgassing and deposition of contaminants onto the transmissive plate. Periodic cleaning of the treatment chamber cleans the plate, thereby substantially restoring the transmittance of ultraviolet broadband radiation. Advantageously, in addition to the transmissive plate, presumably also th...

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Abstract

Apparatuses and processes for treating dielectric materials such as low k dielectric materials, premetal dielectric materials, barrier layers, and the like, generally comprise a radiation source module, a process chamber module coupled to the radiation source module; and a loadlock chamber module in operative communication with the process chamber and a wafer handler. The atmosphere of each one of the modules can be controlled as may be desired for different types of dielectric materials. The radiation source module includes a reflector, an ultraviolet radiation source, and a plate transmissive to the wavelengths of about 150 nm to about 300 nm, to define a sealed interior region, wherein the sealed interior region is in fluid communication with a fluid source.

Description

[0001] Cross References to Related Applications [0002] This application is related to and claims priority to US Provisional Application No. 60 / 581,185, filed June 18, 2004, which is hereby incorporated by reference in its entirety. technical field [0003] The present invention relates generally to apparatus for curing and / or removing porogens from dielectric materials, and more particularly to apparatus for curing low-k dielectric materials and / or removing porogens from low-k values ​​with ultraviolet radiation in a controlled environment. Device for removing porogens from dielectric materials. Background technique [0004] As the dimensions of semiconductor and other microelectronic devices continue to decrease, the demands on the device components continue to grow. For example, preventing capacitive crosstalk between interconnect lines becomes more important for smaller devices. Capacitive crosstalk is generally a function of the distance between conductors and the di...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/00
CPCH01L21/67115H01L21/00
Inventor C·瓦德弗里德C·加默O·埃斯科尔西亚I·贝里P·萨克蒂韦尔
Owner AXCELIS TECHNOLOGIES