High capacity thin module system and method

A circuit module and type technology, which is applied in the structural connection of printed circuits, printed circuit components, etc., can solve problems such as deterioration of heat dissipation characteristics of DIMM circuit modules.
CN101209003AInactive Publication Date: 2008-06-25STAKTEK GROUP LP
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Patent Information

Authority / Receiving Office
CN · China
Current Assignee / Owner
STAKTEK GROUP LP
Publication Date
2008-06-25
Estimated Expiration
Not applicable · inactive patent

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Abstract

Flexible circuitry is populated with integrated circuitry disposed along one or both of its major sides. Contacts distributed along the flexible circuitry provide connection between the module and an application environment. The circuit-populated flexible circuitry is disposed about an edge of a rigid substrate thus placing the integrated circuitry on one or both sides of the substrate with one or two layers of integrated circuitry on one or both sides of the substrate. The substrate form is preferably devised from thermally conductive materials and includes a high thermal conductivity core or area that is disposed proximal to higher thermal energy devices such as an AMB when the flex circuit is brought about the substrate. Other variations include thermally-conductive clips that grasp respective ICs on opposite sides of the module to further shunt heat from the ICs. Preferred extensions from the substrate body or substrate core encourage reduced thermal variations amongst the integrated circuits of the module.
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Description

technical field

[0001] The present invention relates to systems and methods for creating high density circuit modules, and more particularly to systems and methods for creating modules with features designed to reduce thermal load concentrations. Background technique

[0002] Memory expansion is one of many areas where high-density circuit module solutions offer space-saving advantages. For example, the well-known DIMM (Dual In-line Memory Module, Dual In-line Memory Module) has been used in various forms for many years to provide memory expansion. A typical DIMM includes a conventional PCB (printed circuit board) with memory devices and supporting digital logic devices mounted on both sides. Typically, a DIMM is installed within the host computer system by inserting the contact support edge of the DIMM into the card edge connector. Typically, systems employing DIMMs offer limited form factor space for such devices, and traditional DIMM-based solutions typically offer only...

Claims

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