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Electromagnetic energy gap structure and multi-layer printed circuit board with the electromagnetic energy gap structure

A technology of electromagnetic energy and grounding layer, applied in printed circuit parts, including printed electrical components, etc., can solve problems such as ground bounce noise suppression, and achieve the effect of saving wiring space

Inactive Publication Date: 2010-04-07
张秋锋
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  • Summary
  • Abstract
  • Description
  • Claims
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AI Technical Summary

Problems solved by technology

[0005] The technical problem to be solved by the present invention is to provide an electromagnetic energy gap structure and a multilayer printed circuit board with the electromagnetic energy gap structure, so as to solve the problem of ground bounce noise suppression disclosed in the prior art

Method used

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  • Electromagnetic energy gap structure and multi-layer printed circuit board with the electromagnetic energy gap structure
  • Electromagnetic energy gap structure and multi-layer printed circuit board with the electromagnetic energy gap structure
  • Electromagnetic energy gap structure and multi-layer printed circuit board with the electromagnetic energy gap structure

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Embodiment Construction

[0040] Specific embodiments are listed below to illustrate the content of the present invention in detail, and the figures are used as an auxiliary description. The symbols mentioned in the description refer to the schematic symbols.

[0041] Reference figure 1 , Is an electromagnetic energy gap structure according to an embodiment of the present invention, including: a ground plane 110, a conductive block 120, and a connecting pillar 130.

[0042] The conductive block 120 is disposed above the ground plane 110, and the two are connected by a connecting pillar 130. The structure of the connecting pillar 130 is a through hole (via hole) structure.

[0043] Please refer again figure 2 , The conductive block 120 has a central end 122 and a conductive trace 124. The conductive trace 124 has a spiral shape and expands outward from the central end 122. The connecting pillar 130 is connected to the ground plane 110 and the central end 122. Here, the connecting pillar 130 has a via hole s...

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Abstract

The invention discloses an electromagnetic bandgap structure and a multilayer printed circuit board provided with the electromagnetic bandgap structure; the electromagnetic bandgap structure comprisesa ground plane, a conducting block and an interconnected column. The conducting block is approximately in a rectangular shape and is provided with a central terminal as well as a conducting wire in aspiral shape and extending from the central terminal to the outside. The conducting block is arranged over the ground plane and is connected to the central terminal of the conducting block and the ground plane through the interconnected column. The electromagnetic bandgap structure and the multilayer printed circuit board can not only restrain ground-bound noise, but also save the wiring space needed by the electromagnetic bandgap structure and can more elastically design the specific frequency noise needed restraining.

Description

Technical field [0001] The invention relates to a printed circuit board, in particular to an electromagnetic energy gap structure and a multilayer printed circuit board with the electromagnetic energy gap structure. Background technique [0002] With the development of circuit design trends such as high speed, small size and low voltage, the effect of ground bounce noise (GBN) (referred to as ground bounce noise) on the printed circuit board has become more and more significant. The effect of bounce noise becomes important and necessary in the design of high-frequency digital circuits. The prior art has proposed various methods to be applied to printed circuit boards to suppress the effect of ground bounce noise. The method includes adding decoupling capacitors around the noise source to form a capacitor wall protection; or cutting a rectangular slit between the power planes to form an isolation effect. [0003] In the traditional multilayer circuit board, in order to suppress th...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/02H05K1/16
Inventor 杨志明赖俊佑薛光华王健霖郭维德
Owner 张秋锋
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