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Method for protecting wafer front structure and performing wafer dicing

A front structure, chip technology, applied in the direction of fine working devices, electrical components, circuits, etc.

Inactive Publication Date: 2012-02-22
TOUCH MICRO SYST TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] In view of this, in order to solve the common adhesive residue problem after the conventional cutting process, the applicant proposes a method for protecting the front side of the wafer and cutting the wafer. The die cut by the method of the present invention not only improves the process yield Stable, and no problem of residual glue pollution

Method used

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  • Method for protecting wafer front structure and performing wafer dicing
  • Method for protecting wafer front structure and performing wafer dicing
  • Method for protecting wafer front structure and performing wafer dicing

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Embodiment Construction

[0018] In order to highlight the advantages and features of the present invention, several preferred embodiments of the present invention are listed below, and are described in detail in conjunction with the drawings as follows:

[0019] First please refer to Figures 1 to 8 The figure shows the operation steps of protecting the pattern on the front side of the wafer and cutting the wafer according to a preferred embodiment of the present invention. like figure 1 As shown, a wafer 10 is provided at first, and the wafer 10 has completed the process of making the elements in the front section, and a plurality of elements 14 are formed on a front surface 12 of the wafer 10, wherein the elements 14 can be micro-electromechanical elements with a three-dimensional structure, which can be sensed or projected. Optical components for imaging or other circuits that transmit electronic signals.

[0020] Then as figure 2 As shown, a photoresist layer 16 is formed on the front surface...

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Abstract

The invention discloses a method for protecting the front structure of a wafer and cutting the wafer. First, a wafer is provided, and a front side of the wafer is provided with a plurality of components, then a protective layer is formed on the front side of the wafer, and then the wafer is fixed on a cutting carrier by using a first adhesive layer, and then the wafer dicing process is performed to form a plurality of tubes. core, and finally remove the first adhesive layer and the protection layer to separate the die for subsequent packaging. Wherein the protective layer is water-soluble glue.

Description

technical field [0001] The present invention relates to a method for protecting the front structure of a wafer, in particular to covering the front surface of the wafer with a water-soluble glue protective layer, and removing the water-soluble glue protection with hot water after the wafer cutting process forms a plurality of tube cores. layer method. Background technique [0002] In response to the ultra-thin chips of consumer electronics products and the special process requirements of micro-electromechanical products, various chip-carrying technologies have been developed and applied to products. According to the existing technology, hundreds or Thousands of dies containing circuits, MEMS structures, or optical components (the number of dies will depend on the size of the wafer, and the size of the individual dies) are neatly fabricated on the wafer, so it takes To separate each integrated circuit from the wafer and package it into an individual with independent function...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B28D5/00H01L21/304
Inventor 陈至贤
Owner TOUCH MICRO SYST TECH