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Path delay fault simulation method and apparatus

A path delay and fault simulation technology, which is applied in the direction of measurement devices, circuits, digital circuit tests, etc., can solve problems such as low efficiency and low accuracy, and achieve the effect of a reliable path delay fault simulation method

Active Publication Date: 2010-06-09
TSINGHUA UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0019] Embodiments of the present invention provide a path delay fault simulation method and device, which are used to increase the speed of fault simulation and solve the problems of low efficiency and low accuracy existing in the path delay fault simulation process in the prior art

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  • Path delay fault simulation method and apparatus
  • Path delay fault simulation method and apparatus

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Embodiment Construction

[0066] The invention constructs a path selection circuit based on a robustly testable path set and a non-robustly testable path set, and the fault simulation is simplified to a logic simulation on the original circuit. The speed of fault simulation is improved and the accuracy of fault simulation is ensured by effectively pruning the path selection circuit.

[0067] The path delay fault referred to in the embodiment of the present invention usually occurs on a path, and the path refers to a section of circuit in which the main input or flip-flop is the starting point and the main output or flip-flop is the termination point, including the Logic gate devices and related signal lines, etc. If a path takes a flip-flop as input, the flip-flop is called a pseudo-input to that path, and if a path takes a flip-flop as an output, that flip-flop is called a pseudo-output to that path.

[0068] The main realization principles, specific implementation modes and corresponding beneficial ...

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Abstract

The embodiment of the invention discloses a simulation method and a device of path delay faults, wherein, firstly, while a circuit topology of a test circuit and a fault set consisting of testabilitypath delay faults in the test circuit are input, a test vector set consisting of test vectors corresponding to all the path delay faults in the fault set is input; according to the paths correspondingto all the path delay faults in the fault set, a path choice circuit is constructed; the path choice circuit is an equivalent circuit of the paths with the path delay faults in the test circuit; according to all the test vectors in the test vector set, backward fault simulation is carried out in the test circuit, and according to the path delay faults obtained from the simulation, the path choicecircuit is pruned. The proposal provided by the embodiment of the invention can provide an accurate simulation result of the path delay faults in short time; therefore, the proposal provides a reliable simulation method of the path delay fault for chip test.

Description

technical field [0001] The invention relates to the technical field of integrated circuit fault simulation, in particular to a path delay fault simulation method and device. Background technique [0002] After the integrated circuit chip is packaged, the quality of the chip needs to be tested. Since the internal circuit of the chip cannot be directly accessed after the chip is packaged, the general method for testing the chip is: inserting test vectors at the input end of the chip, and collecting test responses at the output end of the chip. The actual test response obtained is compared with the test response obtained by the fault-free circuit, so as to determine whether the chip circuit is faulty or not. A test vector refers to a set of logic values ​​placed into the internal circuit through the chip input. [0003] In order to study the problem, it is usually necessary to abstract the physical defect in the actual chip into a logical fault model. The commonly used fault...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01R31/28G01R31/317G01R31/3185H01L21/82G06F17/50
Inventor 向东赵阳
Owner TSINGHUA UNIV
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