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Vacuum container, pressure-resisting containing and sealing method thereof

A vacuum vessel and pressure vessel technology, applied in the direction of pressure vessel/vacuum vessel, pressure vessel used in chemical process, semiconductor/solid device manufacturing, etc., can solve problems such as manufacturing difficulties and achieve the effect of easy manufacturing

Inactive Publication Date: 2008-09-10
TOKYO ELECTRON LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In order to divide the processing space S from the upper space 17a in this case as well to maintain its vacuum degree, the spacer 17 must be formed integrally with the spacer 14 to provide a gap between the top surface of the processing container 11 and the upper electrode base 16. The spacer 17 is configured to be sandwiched between the O-rings 10, 10. However, the size of the spacer 17 must also be increased as the size of the device increases. As a result, there is a problem that its manufacture becomes difficult.

Method used

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  • Vacuum container, pressure-resisting containing and sealing method thereof
  • Vacuum container, pressure-resisting containing and sealing method thereof
  • Vacuum container, pressure-resisting containing and sealing method thereof

Examples

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no. 1 approach

[0060] Hereinafter, an example in which the vacuum container of the present invention is applied to a plasma processing apparatus for etching an FPD substrate B will be described with reference to FIG. 1 . The plasma processing apparatus 2 of FIG. 1 has a grounded angular cylindrical processing container 21 for etching a substrate B, and this processing container 21 corresponds to a vacuum container within the scope of the invention. The processing container 21 is made of aluminum having a rectangular planar shape, has a container body 21A with an open top, and an upper cover 21B provided to close the top opening of the container body 21A. In order to maintain the airtightness of the processing space S in the processing container 21, the container main body 21A and the upper cover 21B are joined via an O-ring 22a. Moreover, the transfer port 22 of the board|substrate B is provided in the side wall of 21 A of container main bodies, and it is comprised so that opening and closin...

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Abstract

The invention provides a vacuum container, a pressure vessel and a sealing method thereof. The vacuum container is inserted with an annular middle component that is divided along circumferential direction. The container including clearance between the divided components of the middle component, can divide internal-external atmosphere of the middle component. The vacuum container structure includes: an annular first sealing component that is composed of an elastic body between the middle component and the first component with a pressing state for air sealing to plug the middle component and the first component along the middle component; an annular second sealing component that is composed of an elastic body between the middle component and the second component with a pressing state for air sealing to plug the middle component and the second component along the middle component; and an annular plate component that peripherals of one side and another side tightly joints with the first sealing component and the second sealing component respectively for air sealing to plug the adjacent divided components each other along the middle component.

Description

technical field [0001] The present invention relates to a vacuum container, a pressure-resistant container and their sealing method. The container is inserted with a ring-shaped intermediate member divided along the circumferential direction, and one of the inner space and the outer space is an atmospheric atmosphere, and the other is a vacuum atmosphere. , and is characterized by a hermetic structure that hermetically divides the two atmospheres. Background technique [0002] For example, it includes a process of forming a circuit pattern on the surface of an FPD (Flat Panel Display: flat panel display) substrate, and in this process, plasma such as etching, sputtering, and CVD (Chemical Vapor Deposition: Chemical Vapor Deposition) is performed on the substrate. deal with. As an apparatus for performing such plasma processing, for example, a parallel plate plasma processing apparatus can be mentioned. [0003] Such a plasma processing apparatus includes a mounting table c...

Claims

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Application Information

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IPC IPC(8): H01L21/00H01L21/02H01L21/3065H01L21/67H01J37/32H05H1/24B01J3/03
CPCH01J37/32513H01J37/32825H01J2237/334
Inventor 出口新悟田中善嗣
Owner TOKYO ELECTRON LTD
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