Process for producing latent catalyst and epoxy resin composition

Abstract

A process for producing a latent phosphonium silicate catalyst, characterized by reacting a proton donor (A) represented by the general formula (1), a trialkoxysilane compound (B), and a phosphonium salt compound (D) represented by the general formula (2) in the presence of a metal alkoxide compound (C).

Description

Technical field The invention relates to a method for manufacturing a latent catalyst, and also relates to an epoxy resin composition. Background technique As a method of encapsulating semiconductor devices (such as IC and LSI) to manufacture semiconductor devices, due to low cost and suitability for mass production, transfer molding methods using epoxy resin compositions are widely used. The characteristics and reliability of semiconductor devices are improved by improving epoxy resins or phenol resins as curing agents. However, with the current market trend toward small-size, light-weight, and high-performance electronic devices, the integration degree of semiconductors used in such devices has increased year by year, and the surface assembly of semiconductor devices has been promoted. In this case, there are very strict requirements for the epoxy resin composition used to encapsulate the semiconductor chip. So there are some problems that cannot be solved by traditional ep...

AI Technical Summary

Problems solved by technology

This makes it difficult to obtain high-yield and high-purity target product phosphonium silicate

Images