Method of forming buried wiring lines, and substrate and display device using the same
A technology for concealing wiring and wiring patterns, applied in the field of display devices, wiring in grooves, and liquid crystal display devices, can solve the problem that metal wiring does not have the required pattern, the balance of current density distribution is difficult, and waste liquid needs to be processed, etc. problems, to achieve the effect of increasing wiring resistance, reducing the number, and improving the aperture ratio
Active Publication Date: 2008-10-01
NEC LCD TECH CORP
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Problems solved by technology
Accordingly, there is a problem that if the method is used for an insulating plate having a wide area or size, not only the reduction in the number of necessary processes is difficult, but also the balance of the current density distribution in the plating bath (which is critical for plating response is important) is also difficult
In addition, another problem arises: a large amount of waste liquid needs to be disposed of
Therefore, there is a possibility that the metal wiring formed in the trench does not have a desired pattern
Method used
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Embodiment Construction
[0083] Preferred embodiments of the present invention will be described in detail below with reference to the accompanying drawings.
[0084] A TFT substrate of an LCD device to which a method for forming a concealed wiring according to an embodiment of the present invention is directed is described below with reference to FIGS. 2 and 3A to 3C. These figures respectively show structures of a TFT portion, a gate input terminal portion, and an intersection portion of a gate line and a drain line, each corresponding to one of pixels in a matrix array provided on a TFT substrate.
[0085] Here, a glass plate is used as insulating plate 1 . However, any other insulating plates other than glass plates may also be used. On the surface of the insulating plate 1, strip-shaped gate lines 2 and gate electrodes 3 are formed, the strip-shaped gate lines 2 extending linearly along the row direction of the matrix (ie, the X direction in FIG. 2 ). , the gate electrode 3 is connected to each...
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Abstract
An method of forming buried wiring lines makes it possible not to limit usable materials for an insulative plate to those having excellent heat resistance and to improve the corrosion resistance of the terminals provided for the buried wiring lines. The surface of an insulative plate is selectively etched using a mask formed on the surface, thereby forming grooves in the surface. A metallic nanoparticle ink is placed over the whole surface of the plate to fill the grooves with the ink, where the mask is being left. The ink is heated for preliminary curing to form a metallic nanoparticle ink film. The part of the film placed on the mask is selectively removed by detaching the mask, thereby leaving the remainder of the film in the grooves. The remaining film in the grooves is heated for main curing, thereby forming desired buried wiring lines.
Description
technical field [0001] The present invention relates to a method for forming concealed wiring, a display device including concealed wiring, and a display device including the substrate. More particularly, the present invention relates to a method for forming wiring buried in a groove formed in the surface of an insulating plate; a substrate for a display device using the method or the concealed wiring formed thereby. bottom; and a display device using the substrate. The present invention is preferably used in a large-area, high-definition, high-aperture-ratio liquid crystal display (LCD) device employing a thin film transistor (TFT). Background technique [0002] In recent years, LCD devices have been widely used as high-resolution display devices. The LCD device includes a substrate on which switching elements such as thin film transistors are formed (hereinafter referred to as "TFT substrate"), and another substrate on which (hereinafter referred to as "TFT substrate") i...
Claims
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IPC IPC(8): H01L21/768H01L21/84H01L23/522H01L23/532H01L27/12G02F1/1362
CPCH05K3/048B82Y20/00H05K3/1258H05K3/002G02F2202/36Y10T29/49155H05K3/107G02F2001/136295H05K2201/09036G02F1/136286H05K2201/0257H05K2203/1131H05K2203/0571G02F1/136295
Inventor 安田亨宁
Owner NEC LCD TECH CORP