Method of manufacturing substrate, substrate manufacturing system, and method of manufacturing display
A manufacturing method and substrate technology, applied in semiconductor/solid-state device manufacturing, instruments, electric solid-state devices, etc., can solve problems such as increasing production time, achieve the effect of reducing production time and improving success rate
Active Publication Date: 2008-10-15
JOLED INC
View PDF1 Cites 11 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
In the past, in order to solve the increased production time of the defect repairing step caused by the work of human operators, for example, as described in Japanese Patent No. 3051623, an automatic repairing method was proposed
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
no. 1 example
no. 2 example
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
Login to View More Abstract
A method of manufacturing a substrate formed with a plurality of wiring patterns on a base, includes: a first inspection step of identifying a faulty wiring pattern having electric short circuit or disconnection by performing an electric inspection respectively for the plurality of wiring patterns; a second inspection step of examining a relative position of a defect on the base and at least one of a type and a size of the defect by an optical inspection; a matching step of matching a result of the first inspection step with a result of the second inspection step, and identifying a critical defect having electric short circuit or disconnection; and a third inspection step of examining a relative position in a pixel and an effective range of the critical defect by an optical inspection.
Description
Substrate manufacturing method, substrate manufacturing system, and display manufacturing method Cross References to Related Applications The present invention contains subject matter related to Japanese Patent Application JP2007-104597 filed in the Japan Patent Office on Apr. 12, 2007, the entire content of which is hereby incorporated by reference. technical field The present invention relates to a substrate manufacturing method and a substrate manufacturing system suitable for manufacturing TFT (Thin Film Transistor) substrates and the like for organic EL (Electroluminescence) displays or liquid crystal displays, and methods of manufacturing displays using the same. Background technique Currently, in FPDs (Flat Panel Displays), the size is increased, the resolution is increased, and the wiring density is increased. Therefore, the yield of the TFT substrate decreases, and defect repair (laser repair) is practically necessary. For example, in a TFT substrate of an org...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More IPC IPC(8): H01L21/66H01L21/84G02F1/13G02F1/1362
CPCH01L27/3276G02F2001/136263H01L2251/568G02F1/136263H10K59/131H10K71/861H10K71/70G02F1/133G02F1/136G02F1/13
Inventor 舆石亮川部英雄向井畅彦筒井亚希子
Owner JOLED INC