Radiating unit and semiconductor package having the same

Abstract

The invention discloses a radiating unit and a semiconductor encapsulating part provided with the radiating unit, wherein, the semiconductor encapsulating part comprises a bearing part, an electronic component electrically connected to the bearing part, a flat part attached to and combined with the electronic component, an extension part connected to the flat part, the radiating unit of a radiating part connected to the extension part, and a molding colloid used for encapsulating the electronic component and the radiating unit; wherein, at least the angle end of the border crest line of the extension part and the flat part is provided with a stress release part to remove the convex angle end of the radiating units caused by stress concentration in the punching process so as to maintain the flatness of the flat part, thus preventing the circuit on the electronic component from being pressed and damaged by a contact point generated between the flat part and the electronic component in the mould pressing process.

Description

technical field [0001] The invention relates to a semiconductor package technology, more specifically, to a heat dissipation unit and a semiconductor package with the heat dissipation unit. Background technique [0002] Semiconductor chips generate high heat during operation. Therefore, in the manufacturing process of semiconductor packages today, a heat sink or heat dissipation structure is connected to the semiconductor chip to improve heat dissipation efficiency. [0003] U.S. Patent No. 6,444,498 discloses a manufacturing method of a semiconductor package, which mainly provides a substrate carrying a plurality of chips arranged in an array, and connects a large-area heat sink on the upper surface of each chip, and then performs Package molding, singulation, and removal of encapsulant above the top surface of the heat sink. However, the above manufacturing method will inevitably cut the heat sink during the singulation process, and the encapsulant remaining on the heat s...

AI Technical Summary

Problems solved by technology

[0008] see Figure 1B and Figure 1C , the heat dissipation unit is made by stamping, and the corner end of the stamped product is prone to protruding deformation due to the extrusion between materials and the stress cannot be released, and this protruding deformation occurs in the flat part 130 and the adjacent extended portion 131 will cause unevenness in the flat portion, and when the heat dissipation unit 13 is attached and combined on the chip 12, the protruding corner end will produce a contact point with the chip 12, and mold pressing During the process, the pressure will be concentrated on the contact point and then crush the circuit on the chip 12

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