Water-cooling head structure

Abstract

The invention relates to a water block structure used to be attached on a heating element. The structure mainly comprises a cavity, wherein, the cavity is provided with a chamber inside; one side or two sides of the cavity is respectively provided with a water inlet pipe and a water outlet pipe which are communicated with the chamber; the chamber is provided with a heat exchange structure inside for heat exchange with working fluid; the top of the cavity is provided with a film which is provided with an actuating element for driving the film to swing up and down so as to oppress the working fluid in the chamber to circularly flow in a single direction; the actuating element is taken as a power source, and simultaneously the water block is made to have a thin structure.

Description

technical field [0001] The invention relates to a heat dissipation structure, in particular to a water cooling head structure for attaching heating elements. Background technique [0002] In today's technology industry, the development of products tends to be more sophisticated. In addition to the miniaturization of the volume, the heat generation is also increasing. Especially in the computer, due to the continuous improvement of its computing performance and the increase of peripheral electronic components, the overall development of the computer The heat is also greatly increased. Therefore, in order to allow the computer to operate normally within the allowable operating temperature range, an additional cooling device must be used to reduce the adverse effects of heat on the operation of the computer. [0003] As far as the heat dissipation devices currently used, in addition to the fan being the most convenient and widely used heat dissipation device, the water-cooled h...

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Problems solved by technology

[0005] In order to solve the problem of space requirement in the prior art, the water cooling head and the pump of the water cooling system are combined with each other, so that the structure of the water cooling head not only has the function of absorbing heat, but also has a driving force inside the water cooling head. The power of the working fluid exists to reduce the volume required by the water cooling system; however, due to the limitation of the traditional pump structure that uses the fan blade structure as the power source, even if the mutual structure of the water cooling head and the pump can reduce one component, the combined The structure of the water-cooled head cannot greatly reduce the volume requirements. In order to meet the needs of more electronic products for water-cooled heat dissipation systems, it is necessary to find another solution to improve the existing problems.

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