The present invention provides a system-in-package module assembly. The system-in-package module assembly includes a substrate, a chip electrically connected to the substrate, an inductor, and an electrical element. The substrate includes a first surface opposite to the first surface. The second surface and the receiving groove, the receiving groove runs through the second surface and the first surface; the inductance includes a magnetic core and an inductance coil, and the magnetic core includes a base body and a protruding part of the base body The boss on the outer surface, the outer surface of the boss protruding from the base body is attached to the second surface, the boss is accommodated in the receiving groove, and the inductance coil is embedded in the boss In the table, the chip includes a mounting surface, the chip is mounted on the first surface and the mounting surface is spaced opposite to the first surface, and the boss in the receiving groove is orthographically projected on the On the mounting surface of the chip, the electrical components are located at the periphery of the chip. The invention also provides a system-in-package module and electronic equipment.