The invention relates to producing and manufacturing of semiconductor electronic devices, in particular to a diode packaging process. The diode packaging process includes: scribing, pasting, welding, plastically sealing, electroplating, rib-cutting, testing, silk printing, and packaging to obtain a diode. A double-core manufacturing process is adopted, so that the defect that multiple-pin pasting packaging is prone to causing empty pins is overcome; the diode is small in size, excellent in electric performance, high in quality and simple and precise in process and has the characteristics of simplicity and practicability; the diode packaging process is universally suitable for high-density integrated circuit board assembling, number of integrated circuit boards is reduced, quality advantage is improved, space and area occupied by the integrated circuit boards are effectively reduced, improving is kept, and production cost is lowered.