System in package (SiP) module assembly, SiP module and electronic equipment

Abstract

The invention provides a system in package (SiP) module assembly. The SiP module assembly comprises a base plate, as well as a chip, an inductor and electrical apparatus elements which are electrically connected with the base plate, wherein the base plate comprises a first surface, a second surface opposite to the first surface and an accommodating groove, and the accommodating groove runs through the second surface and the first surface; the inductor comprises a magnetic core and an inductor coil, the magnetic core comprises a base body and a lug boss convexly arranged on one outer surface of the base body, the outer surface, convexly provided with the lug boss, of the base body is attached with the second surface, the lug boss is accommodated in the accommodating groove, the inductor coil is embedded in the lug boss, the chip comprises a mounting surface, the chip is mounted on the first surface and the mounting surface and the first surface are arranged oppositely at an interval, the lug boss inside the accommodating groove is orthographically projected onto the mounting surface of the chip, and the electrical apparatus elements are positioned on the periphery of the chip. The invention also provides an SiP module and electronic equipment.

Description

technical field [0001] The invention relates to the technical field of packaging of electronic devices, in particular to a system-in-package module assembly, a system-in-package module and electronic equipment. Background technique [0002] With the rapid growth of the portable consumer electronics market, how to accelerate the improvement of the performance of portable products in terms of thinness, lightness, small size, and low power consumption has become an important issue for system manufacturers. The system-in-package module (SiPModuleSysteminPackage or ModuleIC) with miniature size and low power consumption is considered to be the most suitable solution for portable products. [0003] The system-in-package module wraps a large number of electronic components, such as chips, resistors, etc., and circuits in a very small package. The biggest advantage is that it can save space and low power consumption. Wireless communication modules including WLAN, Bluetooth, GPS, Wi...

AI Technical Summary

Problems solved by technology

The existing system-in-package module integrates electronic components such as control chips, resistors, and inductors on the surface of the substrate, and the inductor is placed above the chip. In terms of thickness, the thickness of the system-in-package is relatively large, which is not suitable for portability. The characteristics of thinness emphasized by type products

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