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Batch preparation of hollow micro-needle based on molding

A micro-needle, hollow technology, applied in the field of medical devices, can solve the problems of silicon is not a biocompatible material, easy to break, unfavorable for batch preparation, etc., and achieve the effect of good biocompatibility and accurate drug delivery

Inactive Publication Date: 2010-06-23
SHANGHAI JIAOTONG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the microneedles prepared by silicon etching technology are complicated, which is not conducive to batch production.
Since silicon is a brittle material that breaks easily, and silicon is not a good biocompatible material

Method used

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  • Batch preparation of hollow micro-needle based on molding
  • Batch preparation of hollow micro-needle based on molding
  • Batch preparation of hollow micro-needle based on molding

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0019] Example 1: Electrocasting iron-nickel alloy mold pressing metal titanium plate

[0020] (1) Prepare the hard mold of the microneedle array by microfabrication method

[0021] Oxidize the silicon wafer on the (100) plane to obtain a silicon wafer with an oxidation thickness of 2 microns. Use photoresist as a mask to etch silicon oxide windows, then use silicon oxide as a mask, use KOH wet etching to form a cone pit array with a depth of 200-400 microns, and then sputter a metal film on the surface of the cone pits , using the method of electrocasting iron-nickel alloy to form a metal microneedle mold array, such as figure 1 shown.

[0022] (2) Preparation of microwells on biocompatible metal or polymer sheets

[0023] Use a 50-micron titanium sheet and stick it flat on the surface of the silicon wafer. A photoresist hole with a diameter of 40 microns was prepared on the surface of the titanium sheet by photolithography. The pitch of the small hole array is the same ...

Embodiment 2

[0026] Example 2: Electrocasting iron-nickel alloy mold to press polymer plate

[0027] (1) Prepare the hard mold of the microneedle array by microfabrication method

[0028] Oxidize the silicon wafer on the (100) plane to obtain a silicon wafer with an oxidation thickness of 2 microns. Use photoresist as a mask to etch silicon oxide windows, then use silicon oxide as a mask, use KOH wet etching to form a cone pit array with a depth of 200-400 microns, and then sputter a metal film on the surface of the cone pits , using the method of electrocasting iron-nickel alloy to form a metal microneedle mold array, such as figure 1 shown.

[0029] (2) Preparation of microwells on biocompatible metal or polymer sheets

[0030] Use a 50-micron polymethyl methacrylate (PMMA) sheet and stick it flat on the surface of the silicon wafer. A small hole with a diameter of 100 microns was prepared on the surface of the PMMA polymer sheet by laser drilling. The pitch of the small hole array ...

Embodiment 3

[0033] Example 3: Silicon carbonitride die pressing titanium plate

[0034] (1) Prepare the hard mold of the microneedle array by microfabrication method

[0035] Oxidize the silicon wafer on the (100) plane to obtain a silicon wafer with an oxidation thickness of 2 microns. The photoresist is used as a mask to etch a silicon oxide window, and then the silicon oxide is used as a mask to etch a cone pit array with a depth of 200-400 microns by wet etching with KOH. Then fill the cavity with silicon carbonitride powder, and sinter at high temperature to form a silicon carbonitride mold microneedle mold array, such as figure 1 shown.

[0036] (2) Preparation of microwells on biocompatible metal or polymer sheets

[0037] Use a 50-micron titanium sheet and stick it flat on the surface of the silicon wafer. A photoresist hole with a diameter of 40 microns was prepared on the surface of the titanium sheet by photolithography. The pitch of the small hole array is the same as tha...

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Abstract

The invention discloses a batch preparation method of a hollow microneedle, which is based on stamping and pertains to medical instrument technology. Firstly, a micro machining method is adopted to prepare the hard mould of microneedle arrays, and then micropores are prepared on a biocompatible metal or a polymer sheet; the space between the micropores is equal to the space between the microneedle arrays; finally, the sheet with micropores is pressed into a protuberant hollow microneedle by stamping; the micropores are the openings of the microneedle prepared by stamping. The batch preparation method of the invention can realize preparation of hollow microneedles in batches at low cost. Since adopting the biocompatible sheet in stamping, the prepared microneedle has good biocompatibility.

Description

technical field [0001] The invention relates to a method for manufacturing a microneedle for transdermal drug delivery in the technical field of medical devices, in particular to a method for preparing a batch of hollow microneedles based on molding. Background technique [0002] With the development of biomedical technology, many new pharmaceutical agents have emerged, which put forward many new requirements for the way of administration. For example, new drugs based on proteins, peptides, and DNA, or some other biosynthetic agents, can no longer fully achieve their efficacy in treating diseases with traditional methods such as oral administration or intravenous injection. Drug delivery through the skin has become a more effective way to replace the traditional drug delivery method. Drug delivery through the skin can not only avoid the decomposition and destruction of the drug by the digestive enzymes in the stomach and the first pass effect of the liver due to oral admini...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): A61M37/00B81C5/00H01L21/00B81C99/00
CPCA61M37/0015A61M2037/0053A61M2037/0023
Inventor 刘景全沈修成王亚军杨春生陈迪
Owner SHANGHAI JIAOTONG UNIV