Aligning mark used for photolithography equipment aligning system and its use method
An alignment mark and alignment system technology, applied in microlithography exposure equipment, optics, photolithography process of pattern surface, etc., can solve the problem of unfavorable lithography equipment alignment, high cost, wedge plate group processing and manufacturing, The requirements of assembly and adjustment are very high, so as to improve the strength of the alignment signal and the dynamic range of detection, reduce the alignment position error, and improve the energy utilization rate.
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[0039] The specific embodiments of the present invention will be further described below in conjunction with the accompanying drawings.
[0040] figure 1 A schematic diagram showing the overall layout and working principle structure between the alignment system of the lithography equipment used in the present invention and the lithography equipment. The composition of the lithographic apparatus includes: an illumination system 1 for providing an exposure beam; a mask holder and a mask table 3 for supporting a reticle 2 with a mask pattern and alignment marks with a periodic structure RM; a projection optical system 4 for projecting the mask pattern on the reticle 2 onto the wafer 6; a wafer holder for supporting the wafer 6 and a wafer stage 7 with fiducial marks engraved on the wafer stage 7 Reference plate 8 for FM, alignment marks with periodic optical structures on wafer 6; off-axis alignment system 5 for mask and wafer alignment; position measurement for mask stage 3 and...
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